Influence of Reflow Profile to Solder Joint Mechanical Strength
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F13%3A43919752" target="_blank" >RIV/49777513:23220/13:43919752 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
čeština
Original language name
Vliv pájecího profilu na mechanickou pevnost pájeného spoje
Original language description
This paper investigates the effects of reflow time and reflow peak temperature on the mechanical strength and the intermetallic compound (IMC) thickness for Sn3.0Ag0.5Cu (SAC) soldered joints. The input variables are the peak temperature and the durationof peak time. The peak temperature has two levels, 235 and 250°C. The time of peak temperature has two levels, 20 and 50s. The IMC thickness increases with higher reflow peak temperature and longer time above liquidus.
Czech name
Vliv pájecího profilu na mechanickou pevnost pájeného spoje
Czech description
This paper investigates the effects of reflow time and reflow peak temperature on the mechanical strength and the intermetallic compound (IMC) thickness for Sn3.0Ag0.5Cu (SAC) soldered joints. The input variables are the peak temperature and the durationof peak time. The peak temperature has two levels, 235 and 250°C. The time of peak temperature has two levels, 20 and 50s. The IMC thickness increases with higher reflow peak temperature and longer time above liquidus.
Classification
Type
O - Miscellaneous
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
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Continuities
S - Specificky vyzkum na vysokych skolach
Others
Publication year
2013
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů