Thick Printed Copper Conductors on Alumina substrates
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F14%3A43922441" target="_blank" >RIV/49777513:23220/14:43922441 - isvavai.cz</a>
Result on the web
<a href="http://ieeexplore.ieee.org/stamp/stamp.jsp?arnumber=6887570" target="_blank" >http://ieeexplore.ieee.org/stamp/stamp.jsp?arnumber=6887570</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE.2014.6887570" target="_blank" >10.1109/ISSE.2014.6887570</a>
Alternative languages
Result language
angličtina
Original language name
Thick Printed Copper Conductors on Alumina substrates
Original language description
This paper deals with a method for design and manufacturing of power electronic substrates. Thick conductive patterns are made by the additive deposition technique using thick copper conductor paste. Substrates with excellent thermal and electrical conductivity, high resistance to thermal cycling stress, high resolution of printed patterns and good mechanical properties are created by this manufacturing process. Gas-tight retort, we used for this specific substrate manufacturing process, is also described in this paper. Mechanical properties of substrates such as adhesion, as well as thermal and electrical properties, were tested in detail.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
JB - Sensors, detecting elements, measurement and regulation
OECD FORD branch
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Result continuities
Project
Result was created during the realization of more than one project. More information in the Projects tab.
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)
Others
Publication year
2014
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
Proceedings of the 2014 37th International Spring Seminar on Electronics Technology (ISSE 2014)
ISBN
978-1-4799-4455-2
ISSN
2161-2528
e-ISSN
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Number of pages
4
Pages from-to
95-98
Publisher name
IEEE
Place of publication
Piscataway
Event location
Drážďany, Německo
Event date
May 7, 2014
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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