Printed thick copper films for power applications
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F18%3A43951910" target="_blank" >RIV/49777513:23220/18:43951910 - isvavai.cz</a>
Result on the web
<a href="https://ieeexplore.ieee.org/document/8546478" target="_blank" >https://ieeexplore.ieee.org/document/8546478</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ESTC.2018.8546478" target="_blank" >10.1109/ESTC.2018.8546478</a>
Alternative languages
Result language
angličtina
Original language name
Printed thick copper films for power applications
Original language description
This paper presents a research focused on development of a new technology for the realization of substrates for power applications such as LED and power modules or CPV receivers. Power electronics puts high demands on substrates and electrical interconnections in terms of high current density in conductors and high dielectric strength and thermal conductivity of insulators. New thick printed copper technology is a selective additive manufacturing process that brings the benefits of material savings and production no chemical waste. It also brings significantly higher pattern resolution (down to 100 μm line/gap) than conventional DBC technology, possibility to realize step & relief thickness profile, Cu plated vias and multilayer circuits capability. Thick printed copper films show sufficient adhesion to alumina and aluminium nitride substrates and have an excellent resistance to thermal shock cycling.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
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OECD FORD branch
20201 - Electrical and electronic engineering
Result continuities
Project
Result was created during the realization of more than one project. More information in the Projects tab.
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)
Others
Publication year
2018
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
2018 7th Electronic System-Integration Technology Conference (ESTC 2018) : proceedings
ISBN
978-1-5386-6813-9
ISSN
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e-ISSN
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Number of pages
5
Pages from-to
1-5
Publisher name
IEEE
Place of publication
Piscataway
Event location
Dresden, Germany
Event date
Sep 18, 2018
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
000469095300138