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Printed thick copper films for power applications

The result's identifiers

  • Result code in IS VaVaI

    <a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F18%3A43951910" target="_blank" >RIV/49777513:23220/18:43951910 - isvavai.cz</a>

  • Result on the web

    <a href="https://ieeexplore.ieee.org/document/8546478" target="_blank" >https://ieeexplore.ieee.org/document/8546478</a>

  • DOI - Digital Object Identifier

    <a href="http://dx.doi.org/10.1109/ESTC.2018.8546478" target="_blank" >10.1109/ESTC.2018.8546478</a>

Alternative languages

  • Result language

    angličtina

  • Original language name

    Printed thick copper films for power applications

  • Original language description

    This paper presents a research focused on development of a new technology for the realization of substrates for power applications such as LED and power modules or CPV receivers. Power electronics puts high demands on substrates and electrical interconnections in terms of high current density in conductors and high dielectric strength and thermal conductivity of insulators. New thick printed copper technology is a selective additive manufacturing process that brings the benefits of material savings and production no chemical waste. It also brings significantly higher pattern resolution (down to 100 μm line/gap) than conventional DBC technology, possibility to realize step &amp; relief thickness profile, Cu plated vias and multilayer circuits capability. Thick printed copper films show sufficient adhesion to alumina and aluminium nitride substrates and have an excellent resistance to thermal shock cycling.

  • Czech name

  • Czech description

Classification

  • Type

    D - Article in proceedings

  • CEP classification

  • OECD FORD branch

    20201 - Electrical and electronic engineering

Result continuities

  • Project

    Result was created during the realization of more than one project. More information in the Projects tab.

  • Continuities

    P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Others

  • Publication year

    2018

  • Confidentiality

    S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Data specific for result type

  • Article name in the collection

    2018 7th Electronic System-Integration Technology Conference (ESTC 2018) : proceedings

  • ISBN

    978-1-5386-6813-9

  • ISSN

  • e-ISSN

  • Number of pages

    5

  • Pages from-to

    1-5

  • Publisher name

    IEEE

  • Place of publication

    Piscataway

  • Event location

    Dresden, Germany

  • Event date

    Sep 18, 2018

  • Type of event by nationality

    WRD - Celosvětová akce

  • UT code for WoS article

    000469095300138