Investigation of cooling capability of ceramic substrates for power electronics applications
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F24%3A43971893" target="_blank" >RIV/49777513:23220/24:43971893 - isvavai.cz</a>
Result on the web
<a href="https://www.sciencedirect.com/science/article/pii/S1359431124007786" target="_blank" >https://www.sciencedirect.com/science/article/pii/S1359431124007786</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1016/j.applthermaleng.2024.123110" target="_blank" >10.1016/j.applthermaleng.2024.123110</a>
Alternative languages
Result language
angličtina
Original language name
Investigation of cooling capability of ceramic substrates for power electronics applications
Original language description
This study investigates the cooling capability of ceramic substrates, which are commonly used in power electronics. Ceramic substrates are pivotal in thermal management because they address the challenges posed by the concurrent trends of miniaturisation and power enhancement in power electronics. Therefore, a detailed numerical study of the cooling capabilities of Al2O3 and AlN substrates with various thicknesses from 0.05 mm to 3 mm in a model configuration with defined liquid cooling is conducted. This model configuration represents a commonly used stack-up for real power electronic modules. The results of the numerical study are verified through experimental measurements. It was demonstrated that for low substrate thicknesses (0.3–0.6 mm), similar cooling capabilities can be achieved by a combination of more efficiently cooling, less thermally conductive, and less expensive substrate. However, AlN is highly efficient for cooling in applications requiring substrates with thicknesses greater than 1.0 mm. The present study proved that increasing the thickness of the AlN substrate has a negligible effect on cooling efficiency. Based on the results of the numerical study, which is verified by experimental measurements, it is possible to design the optimal thickness of the ceramic substrate, flow rate of the cooling medium, and material of the ceramic substrate to achieve the required power dissipation from the substrate without exceeding the maximum defined operating temperature.
Czech name
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Czech description
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Classification
Type
J<sub>imp</sub> - Article in a specialist periodical, which is included in the Web of Science database
CEP classification
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OECD FORD branch
20201 - Electrical and electronic engineering
Result continuities
Project
<a href="/en/project/TN02000067" target="_blank" >TN02000067: Future Electronics for Industry 4.0 and Medical 4.0</a><br>
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)
Others
Publication year
2024
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Name of the periodical
Applied Thermal Engineering
ISSN
1359-4311
e-ISSN
1873-5606
Volume of the periodical
247
Issue of the periodical within the volume
June 2024
Country of publishing house
GB - UNITED KINGDOM
Number of pages
10
Pages from-to
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UT code for WoS article
001225595100001
EID of the result in the Scopus database
2-s2.0-85189754467