Pulsed dc dual magnetron with a gas injection inside discharge and tilted sputtering

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23520%2F03%3A00000073" target="_blank" >RIV/49777513:23520/03:00000073 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Result language
angličtina
Original language name
Pulsed dc dual magnetron with a gas injection inside discharge and tilted sputtering
Original language description
Main problem in dc reactive magnetron sputtering of insulating films are target poisoning, hysteresis effect and process instabilities due to micro-arcing on the target surface. These problems can be overcome when pulsed magnetron sputtering is used. Toachieve the high values of a deposition rate of films the magnetron must operate under a very high-power loading of its target. This results in problems with target cooling and rarefaction of the sputtering gas in front of the magnetron target. This study is devoted to sputtering of copper films using a pulsed dual magnetron with gas injection inside the discharge.
Czech name
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Czech description
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Project
<a href="/en/project/ME%20529" target="_blank" >ME 529: Nanostructured thin films</a><br>
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>Z - Vyzkumny zamer (s odkazem do CEZ)

Publication year
2003
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
Proceedings of the XIVth Symposium on Application of Plasma Processes
ISBN
8080401950
ISSN
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e-ISSN
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Number of pages
2
Pages from-to
49-50
Publisher name
Military Academy
Place of publication
Liptovský Mikuláš
Event location
Liptovský Mikuláš
Event date
Jan 13, 2003
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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