High-power pulsed magnetron sputtering with a grooved target

Result code in IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23520%2F03%3A00000135" target="_blank" >RIV/49777513:23520/03:00000135 - isvavai.cz</a>

Result on the web

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DOI - Digital Object Identifier

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Result language

angličtina

Original language name

High-power pulsed magnetron sputtering with a grooved target

Original language description

Pulsed magnetron sputtering is a new progressive method of film deposition, which is applicable to master a reproducible formation of insulating films, e.g. oxides, with a high deposition rate close to that of pure metals, and also in other applications, where very high rates of film deposition and ionized coating particles are needed. We show that magnetron equiped with a grooved target makes it possible to significantly decrease the magnetron pulse voltage. Then the ionized high-rate sputtering, requiring a high average target power loading in a pulse, can be realized at the repetition frequencies in the range from 10 to 50 kHz.

Czech name

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Czech description

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Type

D - Article in proceedings

CEP classification

BL - Plasma physics and discharge through gases

OECD FORD branch

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Project

<a href="/en/project/ME%20529" target="_blank" >ME 529: Nanostructured thin films</a><br>

Continuities

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>Z - Vyzkumny zamer (s odkazem do CEZ)

Publication year

2003

Confidentiality

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection

JUNIORMAT '03

ISBN

80-214-2462-1

ISSN

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e-ISSN

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Number of pages

2

Pages from-to

48-49

Publisher name

University of Technology

Place of publication

Brno

Event location

Brno

Event date

Sep 23, 2003

Type of event by nationality

EUR - Evropská akce

UT code for WoS article

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