Effect of the voltage pulse characteristics on high-power impulse magnetron sputtering of copper
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23520%2F13%3A43916989" target="_blank" >RIV/49777513:23520/13:43916989 - isvavai.cz</a>
Result on the web
<a href="http://dx.doi.org/10.1088/0963-0252/22/1/015009" target="_blank" >http://dx.doi.org/10.1088/0963-0252/22/1/015009</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1088/0963-0252/22/1/015009" target="_blank" >10.1088/0963-0252/22/1/015009</a>
Alternative languages
Result language
angličtina
Original language name
Effect of the voltage pulse characteristics on high-power impulse magnetron sputtering of copper
Original language description
We present a model analysis of a high-power impulse magnetron sputtering of copper. A non-stationary two-zone model was used to calculate the deposition rate and the ionized fraction of sputtered copper atoms in the flux onto the substrate for various pulse lengths (20 ? 400 microseconds), pulse shapes (a fixed target voltage of 900 V and stepwise ascending (800 ? 1000 V) or descending (1000 ? 800 V) target voltages), repetition frequencies (100 ? 2000 Hz) and magnetic field strengths in front of the target (350 ? 450 G) at an argon pressure of 1 Pa. We show that sufficiently long pulses (at least 100 microseconds) which allow for the build-up of a high density plasma in front of the target (diameter of 50 mm) are necessary to achieve high target powerdensities in a pulse and consequently, high degrees of ionization of the sputtered atoms. However, the high degree of ionization of the sputtered copper atoms leads necessarily to lower deposition rates when compared to the dc magnetron
Czech name
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Czech description
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Classification
Type
J<sub>x</sub> - Unclassified - Peer-reviewed scientific article (Jimp, Jsc and Jost)
CEP classification
BL - Plasma physics and discharge through gases
OECD FORD branch
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Result continuities
Project
<a href="/en/project/OC10045" target="_blank" >OC10045: Novel plasma sources for film deposition and surface modification</a><br>
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)
Others
Publication year
2013
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Name of the periodical
PLASMA SOURCES SCIENCE & TECHNOLOGY
ISSN
0963-0252
e-ISSN
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Volume of the periodical
2013
Issue of the periodical within the volume
22
Country of publishing house
GB - UNITED KINGDOM
Number of pages
9
Pages from-to
015009-1-015009-9
UT code for WoS article
000314966300014
EID of the result in the Scopus database
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