Ion flux characteristics in high-power pulsed magnetron sputtering discharges
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23520%2F07%3A00000061" target="_blank" >RIV/49777513:23520/07:00000061 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
Ion flux characteristics in high-power pulsed magnetron sputtering discharges
Original language description
High-power pulsed dc magnetron discharges for ionized high-rate sputtering of copper films were investigated. The repetition frequency was 1kHz at a fixed 20% duty cycle and argon pressures of 0.5Pa and 5Pa. Time evolutions of the discharge characteristics were measured at a target power density in a pulse up to 950W/cm2. Time-averaged mass spectroscopy was performed at substrate positions. It was shown that copper ions are strongly dominant in total ion fluxes onto the substrate. Their energy distributions with a broadened low-energy part at a lower pressure are extended to higher energies (up to 45eV relative to ground potential for the target-to-substrate distance of 100mm).
Czech name
Charakterizace iontových toků ve vysokovýkonových pulzních magnetronových výbojích
Czech description
45eV vzhledem k potenciálu zem
Classification
Type
J<sub>x</sub> - Unclassified - Peer-reviewed scientific article (Jimp, Jsc and Jost)
CEP classification
BL - Plasma physics and discharge through gases
OECD FORD branch
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Result continuities
Project
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Continuities
Z - Vyzkumny zamer (s odkazem do CEZ)
Others
Publication year
2007
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Name of the periodical
Europhysics Letters
ISSN
0295-5075
e-ISSN
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Volume of the periodical
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Issue of the periodical within the volume
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Country of publishing house
GB - UNITED KINGDOM
Number of pages
1
Pages from-to
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UT code for WoS article
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EID of the result in the Scopus database
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