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Transfer of graphene from copper foils to dielectric substrates

The result's identifiers

  • Result code in IS VaVaI

    <a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F60461373%3A22310%2F19%3A43919706" target="_blank" >RIV/60461373:22310/19:43919706 - isvavai.cz</a>

  • Result on the web

  • DOI - Digital Object Identifier

Alternative languages

  • Result language

    angličtina

  • Original language name

    Transfer of graphene from copper foils to dielectric substrates

  • Original language description

    The subject of this contribution is modification of the method for graphene transfer from copper onto a dielectric substrate. Gradually, two methods had been proposed and tested in laboratory practice, which enabled preparation of graphene film on dielectric substrate with parameters nearing to single-layer (SL) graphene with a minimum of failures. Usability of these methods was verified by measuring electrical parameters of graphene prepared this way.

  • Czech name

  • Czech description

Classification

  • Type

    D - Article in proceedings

  • CEP classification

  • OECD FORD branch

    20501 - Materials engineering

Result continuities

  • Project

    <a href="/en/project/GA17-00607S" target="_blank" >GA17-00607S: Complex Artificial Electromagnetic Structures and Nanostructures</a><br>

  • Continuities

    P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Others

  • Publication year

    2019

  • Confidentiality

    S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Data specific for result type

  • Article name in the collection

    IMAPS Flash Conference

  • ISBN

    978-80-214-5796-6

  • ISSN

  • e-ISSN

  • Number of pages

    2

  • Pages from-to

    70-71

  • Publisher name

    IMAPS CZ&amp;amp;SK

  • Place of publication

    Praha

  • Event location

    Brno

  • Event date

    Oct 24, 2019

  • Type of event by nationality

    WRD - Celosvětová akce

  • UT code for WoS article