The effect of silicon substrate on thickness of SiO2 thin film analysed by spectral reflectometry and interferometry
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F61989100%3A27350%2F09%3A00021680" target="_blank" >RIV/61989100:27350/09:00021680 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
The effect of silicon substrate on thickness of SiO2 thin film analysed by spectral reflectometry and interferometry
Original language description
Techniques of spectral reflectometry and interferometry are used for measuring small changes in thickness of SiO2 thin film grown by thermal oxidation on different silicon substrates. A slightly dispersive Michelson interferometer with one of its mirrorsreplaced by a thin-film structure is used to measure the reflectance and interferometric phase of the thin-film structure at the same time. The experimental data are used to determine precisely the thickness of the SiO2 thin film on silicon wafers of two crystallographic orientations and different dopant concentrations.We confirmed very good agreement between the experimental data and theory and revealed that the thin-film thickness, which varies with the type of silicon substrate, depends linearly onthe wavelength at which minimum in the spectral reflectance occurs. Similar behaviour was revealed for the interferometric phase.
Czech name
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Czech description
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Classification
Type
J<sub>x</sub> - Unclassified - Peer-reviewed scientific article (Jimp, Jsc and Jost)
CEP classification
BH - Optics, masers and lasers
OECD FORD branch
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Result continuities
Project
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Continuities
Z - Vyzkumny zamer (s odkazem do CEZ)
Others
Publication year
2009
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Name of the periodical
APPLIED PHYSICS B-LASERS AND OPTICS
ISSN
0946-2171
e-ISSN
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Volume of the periodical
95
Issue of the periodical within the volume
4
Country of publishing house
US - UNITED STATES
Number of pages
5
Pages from-to
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UT code for WoS article
000266073200023
EID of the result in the Scopus database
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