All
All

What are you looking for?

All
Projects
Organizations

Quick search

  • Projects supported by TA ČR
  • Excellent projects
  • Projects with the highest public support
  • Current projects

Smart search

  • That is how I find a specific +word
  • That is how I leave the -word out of the results
  • “That is how I can find the whole phrase”

Investigation of residual stress in structured diamond films grown on silicon

Result description

Thin diamond strips on Si with the thickness of approx. 0.5 and 1 ?m and two different widths (100 and 200 ?m) were fabricated in two different ways: i) selective ion etching of the continuous diamond films and ii) selective area diamond growth. The stress induced in the films was measured by Raman spectroscopy. The measured values were in the range from -0.7 to -0.1 GPa. It was found that the stress was compressive and independent of the film thickness. In the films deposited at 950 K, more compressivestress than at 1100 K was measured. The thermal part of the stress as a consequence of heterostructure cooling from high deposition temperature down to room temperature was calculated by Finite Element Method (FEM) simulations and compared with the measurement.

Keywords

CVD diamondthermal stressselective area depositionFEM simulations

The result's identifiers

Alternative languages

  • Result language

    angličtina

  • Original language name

    Investigation of residual stress in structured diamond films grown on silicon

  • Original language description

    Thin diamond strips on Si with the thickness of approx. 0.5 and 1 ?m and two different widths (100 and 200 ?m) were fabricated in two different ways: i) selective ion etching of the continuous diamond films and ii) selective area diamond growth. The stress induced in the films was measured by Raman spectroscopy. The measured values were in the range from -0.7 to -0.1 GPa. It was found that the stress was compressive and independent of the film thickness. In the films deposited at 950 K, more compressivestress than at 1100 K was measured. The thermal part of the stress as a consequence of heterostructure cooling from high deposition temperature down to room temperature was calculated by Finite Element Method (FEM) simulations and compared with the measurement.

  • Czech name

  • Czech description

Classification

  • Type

    Jx - Unclassified - Peer-reviewed scientific article (Jimp, Jsc and Jost)

  • CEP classification

    BM - Solid-state physics and magnetism

  • OECD FORD branch

Result continuities

Others

  • Publication year

    2015

  • Confidentiality

    S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Data specific for result type

  • Name of the periodical

    Thin Solid Films

  • ISSN

    0040-6090

  • e-ISSN

  • Volume of the periodical

    589

  • Issue of the periodical within the volume

    Aug

  • Country of publishing house

    CH - SWITZERLAND

  • Number of pages

    7

  • Pages from-to

    857-863

  • UT code for WoS article

    000360320000135

  • EID of the result in the Scopus database

    2-s2.0-84940047315

Basic information

Result type

Jx - Unclassified - Peer-reviewed scientific article (Jimp, Jsc and Jost)

Jx

CEP

BM - Solid-state physics and magnetism

Year of implementation

2015