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Evaluation of the Mechanical Stressed Lead and Lead Free Soldered Joints

The result's identifiers

  • Result code in IS VaVaI

    <a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F05%3A03115602" target="_blank" >RIV/68407700:21230/05:03115602 - isvavai.cz</a>

  • Result on the web

  • DOI - Digital Object Identifier

Alternative languages

  • Result language

    angličtina

  • Original language name

    Evaluation of the Mechanical Stressed Lead and Lead Free Soldered Joints

  • Original language description

    Mechanical stress changes electrical properties of the soldered joints, such as electrical resistance. Mechanical stress could cause the occurrence of cracks on the surface of the soldered joints.

  • Czech name

    Hodnocení mechanicky namáhaných olovnatých a bezolovnatých pájených spojů

  • Czech description

    Není k dispozici

Classification

  • Type

    A - Audiovisual production

  • CEP classification

    JA - Electronics and optoelectronics

  • OECD FORD branch

Result continuities

  • Project

  • Continuities

    Z - Vyzkumny zamer (s odkazem do CEZ)

Others

  • Publication year

    2005

  • Confidentiality

    S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Data specific for result type

  • ISBN

  • Place of publication

    Praha

  • Publisher/client name

  • Version

  • Carrier ID

    neuvedeno