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The Interface between Different Types of Thick Films Layers

The result's identifiers

  • Result code in IS VaVaI

    <a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F10%3A00171375" target="_blank" >RIV/68407700:21230/10:00171375 - isvavai.cz</a>

  • Result on the web

  • DOI - Digital Object Identifier

Alternative languages

  • Result language

    angličtina

  • Original language name

    The Interface between Different Types of Thick Films Layers

  • Original language description

    The investigation of conductive and resistive layers interface is topic of the work. Layers of measured structure were deposited by screen-printing of polymer pastes. The measured structure consists of contact area with different geometry. Contact resistance of interface between conductive and resistive layers was measured as a parameter of quality. The three-wire method was used for measurement. Experimental results were analyzed in the context of contacts geometry and frequency of powered signal.

  • Czech name

  • Czech description

Classification

  • Type

    D - Article in proceedings

  • CEP classification

    JA - Electronics and optoelectronics

  • OECD FORD branch

Result continuities

  • Project

  • Continuities

    Z - Vyzkumny zamer (s odkazem do CEZ)

Others

  • Publication year

    2010

  • Confidentiality

    S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Data specific for result type

  • Article name in the collection

    33rd International Spring Seminar on Electronics Technology

  • ISBN

    978-1-4244-7849-1

  • ISSN

  • e-ISSN

  • Number of pages

    4

  • Pages from-to

  • Publisher name

    IEEE

  • Place of publication

    New York

  • Event location

    Warsaw

  • Event date

    May 12, 2010

  • Type of event by nationality

    WRD - Celosvětová akce

  • UT code for WoS article