Solderability and aggression comparison of commonly used fluxes
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F12%3A00199209" target="_blank" >RIV/68407700:21230/12:00199209 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
Solderability and aggression comparison of commonly used fluxes
Original language description
This article deals with solderability and aggression comparison of several types of fluxes. In our experiments we compare four fluxes (flux R, flux F 1, flux for nickel, and flux for aluminum). For solderability measurement we used wetting balance method. The flux aggression against copper layer was measured on spectrophotometer after the reflow process and it was determined by the measurement of light absorption on spectrophotometer.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
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Continuities
S - Specificky vyzkum na vysokych skolach
Others
Publication year
2012
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
Proceedings of Electronic Devices and Systems EDS 2012
ISBN
978-80-214-4539-0
ISSN
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e-ISSN
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Number of pages
4
Pages from-to
12-15
Publisher name
VUT v Brně, FEKT
Place of publication
Brno
Event location
Brno
Event date
Jun 28, 2012
Type of event by nationality
EUR - Evropská akce
UT code for WoS article
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