The Sputtered Aluminium Thin Film
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F14%3A00224699" target="_blank" >RIV/68407700:21230/14:00224699 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
The Sputtered Aluminium Thin Film
Original language description
The work is concerned about thin film prepared by methods of physical vapor deposition. The thin film aluminum layers were prepared, measured and analyzed. Tested layers were deposited by technology of sputtering from aluminum target on glass substrate.The properties of thin film layers such as electrical resistance and thickness were measured. The thickness of layer was evaluated from scanned profile of sample surface by stylus method. Obtained experimental data were investigated in dependence to parameters of depositing process. The different conditions of sputtering process used for sample preparation were set up by combinations of power of plasma and time of deposition process.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
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Continuities
V - Vyzkumna aktivita podporovana z jinych verejnych zdroju
Others
Publication year
2014
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
Electronic Devices and Systems IMAPS CS International Conference 2014
ISBN
978-80-214-4985-5
ISSN
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e-ISSN
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Number of pages
5
Pages from-to
37-41
Publisher name
Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií
Place of publication
Brno
Event location
Brno
Event date
Jun 25, 2014
Type of event by nationality
EUR - Evropská akce
UT code for WoS article
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