Study of Solder Spreadability at Different Soldering Conditions Using Factorial Experiments
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F19%3A00338223" target="_blank" >RIV/68407700:21230/19:00338223 - isvavai.cz</a>
Result on the web
<a href="https://doi.org/10.1109/ISSE.2019.8810262" target="_blank" >https://doi.org/10.1109/ISSE.2019.8810262</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE.2019.8810262" target="_blank" >10.1109/ISSE.2019.8810262</a>
Alternative languages
Result language
angličtina
Original language name
Study of Solder Spreadability at Different Soldering Conditions Using Factorial Experiments
Original language description
The solder spreadability on the soldering surfaces is one of the critical parameters for reflow soldering which is used for electronic assembly. Solder spreadability gives us knowledge about wetting, surface tensions, and reliability issues like bridging etc. This article deals with full factorial experiments of solders spreadability of four different surface finishes (passivated copper, electroless nickel immersion gold - ENIG, immersion tin - ImSn and hot air solder levelling - HASL), and five types of solder paste with the following solder alloy composition: Sn62Pb36Ag2, Sn95.5Ag4Cu0.5, Sn96.5Ag3.5, Sn96.5Ag3Cu0.5, Sn42Bi58. Additionally, three different reflow soldering techniques (infra radiation, convection air and vapour phase soldering) were used in the experiment. The use of factorial experiments is a novelty in our approach. Results show that all used materials and solder pastes have good spreadability. The best results were achieved for copper surface finish.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
—
OECD FORD branch
20201 - Electrical and electronic engineering
Result continuities
Project
—
Continuities
I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace
Others
Publication year
2019
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
2019 42nd International Spring Seminar on Electronics Technology (ISSE)
ISBN
978-1-7281-1874-1
ISSN
2161-2528
e-ISSN
2161-2536
Number of pages
4
Pages from-to
—
Publisher name
IEEE Press
Place of publication
New York
Event location
Wroclaw
Event date
May 15, 2019
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
000507501000034