Electrochemical migration of lead-free solders and Ag-based electrically conductive adhesives in NaCl solution

Result code in IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F19%3A00340028" target="_blank" >RIV/68407700:21230/19:00340028 - isvavai.cz</a>

Result on the web

<a href="http://hdl.handle.net/11025/36515" target="_blank" >http://hdl.handle.net/11025/36515</a>

DOI - Digital Object Identifier

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Result language

angličtina

Original language name

Electrochemical migration of lead-free solders and Ag-based electrically conductive adhesives in NaCl solution

Original language description

In this article, the electrochemical migration of lead-free solders and electrically conductive adhesives with an Ag content of more than 70% was studied by using a water drop test in NaCl solution. The results of solder pastes were compared with the results of electrically conductive adhesives. It was found that some solder pastes with a low Ag content have a lower susceptibility to electrochemical migration than, for example, solder paste Sn42Bi58. The highest resistance to corrosion has a conductive adhesive CRM-1033B with an Ag content of 75%. Resistance and voltage during the water drop test. From the measured values, it was determined that the values of resistance and voltage decrease with dendrite growing. X-ray spectroscopy was also performed to determine the chemical elemental composition of dendrites. It was found that the dominant element of the dendrite of solder pastes was Sn. In the case of electrically conductive adhesives, Ag was the main element of the dendrite.

Czech name

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Czech description

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Type

J_ost - Miscellaneous article in a specialist periodical

CEP classification

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OECD FORD branch

20201 - Electrical and electronic engineering

Project

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Continuities

I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Publication year

2019

Confidentiality

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Name of the periodical

ElectroScope

ISSN

1802-4564

e-ISSN

1802-4564

Volume of the periodical

2019

Issue of the periodical within the volume

2

Country of publishing house

CZ - CZECH REPUBLIC

Number of pages

5

Pages from-to

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UT code for WoS article

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EID of the result in the Scopus database

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