Comment on: "Reactive wetting of solders on Cu and Cu6Sn5/Cu3Sn/Cu substrates using wetting balance"
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F21%3A00349312" target="_blank" >RIV/68407700:21230/21:00349312 - isvavai.cz</a>
Result on the web
<a href="https://doi.org/10.1016/j.scriptamat.2021.113728" target="_blank" >https://doi.org/10.1016/j.scriptamat.2021.113728</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1016/j.scriptamat.2021.113728" target="_blank" >10.1016/j.scriptamat.2021.113728</a>
Alternative languages
Result language
angličtina
Original language name
Comment on: "Reactive wetting of solders on Cu and Cu6Sn5/Cu3Sn/Cu substrates using wetting balance"
Original language description
In this contribution, as comments to the paper in Scripta Materialia, Volume 55, Issue 9, Pages 823-826, November 2006, will be shown that the residual force marked as Fd is not correctly described. This residual force is recorded during wetting force measurement by wetting balance method, and it was wrongly used as a part of withdrawal force Fwd. The correct relation between residual force Fd and withdrawal force Fwd will be explained more deeply in this comment. (c) 2021 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
Czech name
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Czech description
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Classification
Type
O - Miscellaneous
CEP classification
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OECD FORD branch
20201 - Electrical and electronic engineering
Result continuities
Project
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Continuities
I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace
Others
Publication year
2021
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů