3D Printed Circuit Boards from Recycled Plastics: Conductive Pattern Properties
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F25%3A00386477" target="_blank" >RIV/68407700:21230/25:00386477 - isvavai.cz</a>
Result on the web
<a href="https://doi.org/10.1109/ISSE65583.2025.11121022" target="_blank" >https://doi.org/10.1109/ISSE65583.2025.11121022</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE65583.2025.11121022" target="_blank" >10.1109/ISSE65583.2025.11121022</a>
Alternative languages
Result language
angličtina
Original language name
3D Printed Circuit Boards from Recycled Plastics: Conductive Pattern Properties
Original language description
The aim of this work is to advance further the development of an environmentally friendly method of manufacturing printed circuit boards (PCBs) using recycled and recyclable 3D printable polymers as an insulating substrate and electrically conductive pastes for the conductive pattern. Previous iterations of this alternative process development were focused on the automatic dispensation of ink from the cartridge to create the conductive pattern. To reduce the time required for production, increase the accuracy of the process, and make it much more implementable in practice, screen printing was employed for the creation of a conductive pattern in this study. Two conductive pastes were used in this study: a silver-based paste and a copper-based paste. For the protection of the patterns against degradation, two different methods were tested: overprinting with another polymer layer by 3D printer and coating with an acrylic varnish. To test the functionality of surface treatments and their effect on the circuit's reliability, samples were placed in a desiccator at 99% relative humidity. The results, however, showed that the effect of the tested surface finish is negligible, and the durability of the conductive patterns under a humid environment is given primarily by the paste itself. The silver-based paste showed no significant change after 125 days in the desiccator. On the contrary, complete degradation of the copper-based patterns occurred after only 6 hours in the desiccator. Despite being more environmentally friendly, the copper-based paste is not practically usable from this point of view without significantly more robust surface protection, such as plating. Therefore, the silver-based pastes will be utilized in further continuation of this project.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
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OECD FORD branch
20201 - Electrical and electronic engineering
Result continuities
Project
<a href="/en/project/SS07020107" target="_blank" >SS07020107: Sustainable Electronics Assembly Utilizing Plastic Waste</a><br>
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)
Others
Publication year
2025
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
2025 International Spring Seminar on Electronics Technology (ISSE)
ISBN
979-8-3315-1217-0
ISSN
2161-2536
e-ISSN
2161-2528
Number of pages
7
Pages from-to
—
Publisher name
Institute of Electrical and Electronics Engineers
Place of publication
New York
Event location
Budapešť
Event date
May 14, 2025
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
001585293500069