Properties of Thin Films on 3D Printed Substrates
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F25%3A00389482" target="_blank" >RIV/68407700:21230/25:00389482 - isvavai.cz</a>
Result on the web
<a href="https://doi.org/10.1109/ISSE65583.2025.11121009" target="_blank" >https://doi.org/10.1109/ISSE65583.2025.11121009</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE65583.2025.11121009" target="_blank" >10.1109/ISSE65583.2025.11121009</a>
Alternative languages
Result language
angličtina
Original language name
Properties of Thin Films on 3D Printed Substrates
Original language description
The aim of this work is to evaluate the deposition process and properties of Aluminum thin films deposited by electromagnetic sputtering and evaporation on 3D printed substrates made using fused filament fabrication (FFF) with various materials (PLA- Polylactic Acid, PETG- polyethylene terephthalate glycol-modified, and recycled PET) and stereolitography (SLA). The structure and the properties of the thin film layers were evaluated via confocal microscopy, using resistance measurement and by measuring the attenuation and reflection of the passing electromagnetic wave. Non-contact measurement of the transmittance of the sample to the electromagnetic wave was used to indirectly measure the minimal and maximal impedance of the thin film layer.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
—
OECD FORD branch
20201 - Electrical and electronic engineering
Result continuities
Project
—
Continuities
I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace
Others
Publication year
2025
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
2025 International Spring Seminar on Electronics Technology (ISSE)
ISBN
979-8-3315-1217-0
ISSN
2161-2536
e-ISSN
2161-2528
Number of pages
5
Pages from-to
—
Publisher name
Institute of Electrical and Electronics Engineers
Place of publication
New York
Event location
Budapešť
Event date
May 14, 2025
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
001585293500065