Residual Strain in PCBs with Cu-Plated Holes

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216208%3A11320%2F17%3A10366665" target="_blank" >RIV/00216208:11320/17:10366665 - isvavai.cz</a>

Nalezeny alternativní kódy

RIV/68407700:21230/17:00315429

Výsledek na webu

<a href="http://dx.doi.org/10.1007/s11664-017-5714-3" target="_blank" >http://dx.doi.org/10.1007/s11664-017-5714-3</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1007/s11664-017-5714-3" target="_blank" >10.1007/s11664-017-5714-3</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Residual Strain in PCBs with Cu-Plated Holes

Popis výsledku v původním jazyce

The residual strain in pure printed circuit boards (PCBs) and PCBs with Cu-plated holes has been obtained by measurement of the temperature dependence of their dilatational characteristics in the x, y, and z directions up to 240A degrees C. Shrinkage in all directions was observed for all samples of both materials in the first thermal cycle. No permanent length changes were observed in the second or subsequent thermal cycles. The residual strain was determined from the difference in relative elongation between the first and second thermal cycles. Relaxation of residual strain occurred only in the first thermal cycle, as a thermally activated process. The highest value of relaxed residual strain was found in the z direction for both materials. Relaxation of residual strain in the z direction of the pure PCB occurred only in the negative strain range, whereas relaxation of the PCB with Cu-plated holes occurred in both the positive and negative strain ranges. The relaxation of the positive strain in the PCB with Cu-plated holes in the z direction implies that this part of the PCB was under pressure during its preparation. This relaxation is a consequence of the high coefficient of thermal expansion of PCB laminate in this direction, which can also lead to cracks in Cu holes when the material is heated above the glass-transition temperature.

Název v anglickém jazyce

Residual Strain in PCBs with Cu-Plated Holes

Popis výsledku anglicky

The residual strain in pure printed circuit boards (PCBs) and PCBs with Cu-plated holes has been obtained by measurement of the temperature dependence of their dilatational characteristics in the x, y, and z directions up to 240A degrees C. Shrinkage in all directions was observed for all samples of both materials in the first thermal cycle. No permanent length changes were observed in the second or subsequent thermal cycles. The residual strain was determined from the difference in relative elongation between the first and second thermal cycles. Relaxation of residual strain occurred only in the first thermal cycle, as a thermally activated process. The highest value of relaxed residual strain was found in the z direction for both materials. Relaxation of residual strain in the z direction of the pure PCB occurred only in the negative strain range, whereas relaxation of the PCB with Cu-plated holes occurred in both the positive and negative strain ranges. The relaxation of the positive strain in the PCB with Cu-plated holes in the z direction implies that this part of the PCB was under pressure during its preparation. This relaxation is a consequence of the high coefficient of thermal expansion of PCB laminate in this direction, which can also lead to cracks in Cu holes when the material is heated above the glass-transition temperature.

Druh

J_imp - Článek v periodiku v databázi Web of Science

CEP obor

—

OECD FORD obor

10302 - Condensed matter physics (including formerly solid state physics, supercond.)

Projekt

<a href="/cs/project/LM2011025" target="_blank" >LM2011025: LMNT - Laboratoře magnetizmu a nízkých teplot - provoz a rozvoj národní výzkumné infrastruktury</a><br>

Návaznosti

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Rok uplatnění

2017

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

Journal of Electronic Materials

ISSN

0361-5235

e-ISSN

—

Svazek periodika

46

Číslo periodika v rámci svazku

12

Stát vydavatele periodika

US - Spojené státy americké

Počet stran výsledku

8

Strana od-do

6984-6991

Kód UT WoS článku

000414363200030

EID výsledku v databázi Scopus

2-s2.0-85026895508