Synchrotronová výpočetní laminografie pro 3D zobrazení plochých objektů s velkým rozlišením

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216224%3A14310%2F07%3A00022443" target="_blank" >RIV/00216224:14310/07:00022443 - isvavai.cz</a>

Výsledek na webu

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DOI - Digital Object Identifier

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Jazyk výsledku

angličtina

Název v původním jazyce

Synchrotron-radiation computed laminography for high-resolution three-dimensional imaging of flat devices

Popis výsledku v původním jazyce

Synchrotron-radiation computed laminography (SRCL) is developed as a method for high-resolution three-dimensional (3D) imaging of regions of interest (ROIs) in all kinds of laterally extended devices. One of the application targets is the 3D X-ray inspection of microsystems. In comparison to computed tomography (CT), the method is based on the inclination of the tomographic axis with respect to the incident X-ray beam by a defined angle. With the microsystem aligned roughly perpendicular to the rotationaxis, the integral X-ray transmission on the two-dimensional (2D) detector does not change exceedingly during the scan. In consequence, the integrity of laterally extended devices can be preserved, what distinguishes SRCL from CT where ROIs have to be destructively extracted (e.g. by cutting out a sample) before being imaged. The potential of the method for three-dimensional imaging of microsystem devices will be demonstrated by examples of flip-chip bonded and wire-bonded devices.

Název v anglickém jazyce

Synchrotron-radiation computed laminography for high-resolution three-dimensional imaging of flat devices

Popis výsledku anglicky

Synchrotron-radiation computed laminography (SRCL) is developed as a method for high-resolution three-dimensional (3D) imaging of regions of interest (ROIs) in all kinds of laterally extended devices. One of the application targets is the 3D X-ray inspection of microsystems. In comparison to computed tomography (CT), the method is based on the inclination of the tomographic axis with respect to the incident X-ray beam by a defined angle. With the microsystem aligned roughly perpendicular to the rotationaxis, the integral X-ray transmission on the two-dimensional (2D) detector does not change exceedingly during the scan. In consequence, the integrity of laterally extended devices can be preserved, what distinguishes SRCL from CT where ROIs have to be destructively extracted (e.g. by cutting out a sample) before being imaged. The potential of the method for three-dimensional imaging of microsystem devices will be demonstrated by examples of flip-chip bonded and wire-bonded devices.

Druh

J_x - Nezařazeno - Článek v odborném periodiku (Jimp, Jsc a Jost)

CEP obor

BM - Fyzika pevných látek a magnetismus

OECD FORD obor

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Projekt

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Návaznosti

Z - Vyzkumny zamer (s odkazem do CEZ)

Rok uplatnění

2007

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

Physica stat.sol.(a)

ISSN

0031-8965

e-ISSN

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Svazek periodika

204

Číslo periodika v rámci svazku

8

Stát vydavatele periodika

NL - Nizozemsko

Počet stran výsledku

6

Strana od-do

2760-2765

Kód UT WoS článku

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EID výsledku v databázi Scopus

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