Thermal analysis of selected tin-based lead-free solder alloys
Identifikátory výsledku
Kód výsledku v IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216224%3A14310%2F09%3A00037461" target="_blank" >RIV/00216224:14310/09:00037461 - isvavai.cz</a>
Výsledek na webu
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DOI - Digital Object Identifier
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Alternativní jazyky
Jazyk výsledku
angličtina
Název v původním jazyce
Thermal analysis of selected tin-based lead-free solder alloys
Popis výsledku v původním jazyce
The Sn-Ag-Cu alloys have favourable solderability and wetting properties and are, therefore, being considered as potential lead-free solder materials. In the present study, tin-based Sn-Ag-Cu and Sn-Ag-Cu-Bi alloys were studied in detail by a differential scanning calorimetry (DSC) and thermodynamic calculations using the CALPHAD approach. The amount of the alloying elements in the materials was chosen to be close to the respective eutectic composition and the nominal compositions were the following: Sn-3.7Ag-0.7Cu, Sn-1.0Ag-0.5Cu-1Bi (in wt.%). Thermal effects during melting and solidifying were experimentally studied by the DSC technique. The microstructure of the samples was determined by the light microscopy and the composition of solidified phaseswas obtained by the energy-dispersive X-ray spectroscopy, respectively. The solidification behaviour under equilibrium conditions was simulated using the Thermo-Calc software package.
Název v anglickém jazyce
Thermal analysis of selected tin-based lead-free solder alloys
Popis výsledku anglicky
The Sn-Ag-Cu alloys have favourable solderability and wetting properties and are, therefore, being considered as potential lead-free solder materials. In the present study, tin-based Sn-Ag-Cu and Sn-Ag-Cu-Bi alloys were studied in detail by a differential scanning calorimetry (DSC) and thermodynamic calculations using the CALPHAD approach. The amount of the alloying elements in the materials was chosen to be close to the respective eutectic composition and the nominal compositions were the following: Sn-3.7Ag-0.7Cu, Sn-1.0Ag-0.5Cu-1Bi (in wt.%). Thermal effects during melting and solidifying were experimentally studied by the DSC technique. The microstructure of the samples was determined by the light microscopy and the composition of solidified phaseswas obtained by the energy-dispersive X-ray spectroscopy, respectively. The solidification behaviour under equilibrium conditions was simulated using the Thermo-Calc software package.
Klasifikace
Druh
J<sub>x</sub> - Nezařazeno - Článek v odborném periodiku (Jimp, Jsc a Jost)
CEP obor
BM - Fyzika pevných látek a magnetismus
OECD FORD obor
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Návaznosti výsledku
Projekt
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Návaznosti
Z - Vyzkumny zamer (s odkazem do CEZ)
Ostatní
Rok uplatnění
2009
Kód důvěrnosti údajů
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Údaje specifické pro druh výsledku
Název periodika
Kovové materiály
ISSN
0023-432X
e-ISSN
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Svazek periodika
47
Číslo periodika v rámci svazku
1
Stát vydavatele periodika
SK - Slovenská republika
Počet stran výsledku
8
Strana od-do
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Kód UT WoS článku
000267933100007
EID výsledku v databázi Scopus
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