Research on soldering AlN ceramics with Cu substrate using Sn-Ag-Ti solder

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F61989100%3A27360%2F19%3A10242426" target="_blank" >RIV/61989100:27360/19:10242426 - isvavai.cz</a>

Výsledek na webu

<a href="https://www.emerald.com/insight/content/doi/10.1108/SSMT-10-2018-0039/full/html" target="_blank" >https://www.emerald.com/insight/content/doi/10.1108/SSMT-10-2018-0039/full/html</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1108/SSMT-10-2018-0039" target="_blank" >10.1108/SSMT-10-2018-0039</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Research on soldering AlN ceramics with Cu substrate using Sn-Ag-Ti solder

Popis výsledku v původním jazyce

Purpose This study aims to solder AlN ceramics with a Cu substrate using an active type Sn-Ag-Ti solder. Soldering was performed with power ultrasound. The Sn3.5Ag2Ti alloy was first studied. Design/methodology/approach It was found to contain a Sn matrix, where both Ag phase - e-Ag3Sn - and Ti phases e-Ti6Sn5 and Ti2Sn3 - were identified. Ti contained in these phases is distributed to the interface with ceramic material. A reaction layer was thus formed. This layer varies in thickness from 0.5 to 3.5 mu m and ensures the wettability of an active solder on the surfaces of ceramic materials. Findings X-ray diffraction analysis proved the presence of new NTi and AlTi2 phases on the fractured surface. Sn plays the main role in bond formation when soldering the Cu substrate with Sn-Ag-Ti solder. The Cu3Sn and Cu6Sn5 phases, which grow in direction from the phase interface to solder matrix, were found in all cases within the solder/Cu substrate interface. The combination of AlN ceramics/Cu joint maintained a shear strength of 29.5 MPa, whereas the Cu/Cu joint showed a somewhat higher shear strength of 39.5 MPa. Originality/value The present study was oriented towards soldering of AlN ceramics with a Cu substrate by the aid of ultrasound, and the fluxless soldering method was applied. Soldering alloy type Sn-Ag-Ti was analysed, and the interactions between the solder and ceramic and/or Cu substrate were studied. The shear strength of fabricated soldered joints was measured.

Název v anglickém jazyce

Research on soldering AlN ceramics with Cu substrate using Sn-Ag-Ti solder

Popis výsledku anglicky

Purpose This study aims to solder AlN ceramics with a Cu substrate using an active type Sn-Ag-Ti solder. Soldering was performed with power ultrasound. The Sn3.5Ag2Ti alloy was first studied. Design/methodology/approach It was found to contain a Sn matrix, where both Ag phase - e-Ag3Sn - and Ti phases e-Ti6Sn5 and Ti2Sn3 - were identified. Ti contained in these phases is distributed to the interface with ceramic material. A reaction layer was thus formed. This layer varies in thickness from 0.5 to 3.5 mu m and ensures the wettability of an active solder on the surfaces of ceramic materials. Findings X-ray diffraction analysis proved the presence of new NTi and AlTi2 phases on the fractured surface. Sn plays the main role in bond formation when soldering the Cu substrate with Sn-Ag-Ti solder. The Cu3Sn and Cu6Sn5 phases, which grow in direction from the phase interface to solder matrix, were found in all cases within the solder/Cu substrate interface. The combination of AlN ceramics/Cu joint maintained a shear strength of 29.5 MPa, whereas the Cu/Cu joint showed a somewhat higher shear strength of 39.5 MPa. Originality/value The present study was oriented towards soldering of AlN ceramics with a Cu substrate by the aid of ultrasound, and the fluxless soldering method was applied. Soldering alloy type Sn-Ag-Ti was analysed, and the interactions between the solder and ceramic and/or Cu substrate were studied. The shear strength of fabricated soldered joints was measured.

Druh

J_imp - Článek v periodiku v databázi Web of Science

CEP obor

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OECD FORD obor

20500 - Materials engineering

Projekt

—

Návaznosti

I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Rok uplatnění

2019

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

Soldering &amp; Surface Mount Technology

ISSN

0954-0911

e-ISSN

—

Svazek periodika

31

Číslo periodika v rámci svazku

2

Stát vydavatele periodika

GB - Spojené království Velké Británie a Severního Irska

Počet stran výsledku

9

Strana od-do

93-101

Kód UT WoS článku

000464744600003

EID výsledku v databázi Scopus

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