Characterizing the soldering alloy type In-Ag-Ti and the study of direct soldering of SiC ceramics and copper

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F61989100%3A27360%2F18%3A10241249" target="_blank" >RIV/61989100:27360/18:10241249 - isvavai.cz</a>

Výsledek na webu

<a href="https://www.mdpi.com/2075-4701/8/4/274" target="_blank" >https://www.mdpi.com/2075-4701/8/4/274</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.3390/met8040274" target="_blank" >10.3390/met8040274</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Characterizing the soldering alloy type In-Ag-Ti and the study of direct soldering of SiC ceramics and copper

Popis výsledku v původním jazyce

The aim of the research was to characterize the soldering alloy In-Ag-Ti type, and to study the direct soldering of SiC ceramics and copper. The In10Ag4Ti solder has a broad melting interval, which mainly depends on its silver content. The liquid point of the solder is 256.5 oC. The solder microstructure is composed of a matrix with solid solution (In), in which the phases of titanium (Ti3In4) and silver (AgIn2) are mainly segregated. The tensile strength of the solder is approximately 13 MPa. The strength of the solder increased with the addition of Ag and Ti. The solder bonds with SiC ceramics, owing to the interaction between active In metal and silicon infiltrated in the ceramics. XRD analysis has proven the interaction of titanium with ceramic material during the formation of the new minority phases of titanium silicide - SiTi and titanium carbide-C5Ti8. In and Ag also affect bond formation with the copper substrate. Two new phases were also observed in the bond interphase-(CuAg)6In5 and (AgCu)In2. The average shear strength of a combined joint of SiC-Cu, fabricated with In10Ag4Ti solder, was 14.5 MPa. The In-Ag-Ti solder type studied possesses excellent solderability with several metallic and ceramic materials.

Název v anglickém jazyce

Characterizing the soldering alloy type In-Ag-Ti and the study of direct soldering of SiC ceramics and copper

Popis výsledku anglicky

The aim of the research was to characterize the soldering alloy In-Ag-Ti type, and to study the direct soldering of SiC ceramics and copper. The In10Ag4Ti solder has a broad melting interval, which mainly depends on its silver content. The liquid point of the solder is 256.5 oC. The solder microstructure is composed of a matrix with solid solution (In), in which the phases of titanium (Ti3In4) and silver (AgIn2) are mainly segregated. The tensile strength of the solder is approximately 13 MPa. The strength of the solder increased with the addition of Ag and Ti. The solder bonds with SiC ceramics, owing to the interaction between active In metal and silicon infiltrated in the ceramics. XRD analysis has proven the interaction of titanium with ceramic material during the formation of the new minority phases of titanium silicide - SiTi and titanium carbide-C5Ti8. In and Ag also affect bond formation with the copper substrate. Two new phases were also observed in the bond interphase-(CuAg)6In5 and (AgCu)In2. The average shear strength of a combined joint of SiC-Cu, fabricated with In10Ag4Ti solder, was 14.5 MPa. The In-Ag-Ti solder type studied possesses excellent solderability with several metallic and ceramic materials.

Druh

J_imp - Článek v periodiku v databázi Web of Science

CEP obor

—

OECD FORD obor

20501 - Materials engineering

Projekt

—

Návaznosti

I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Rok uplatnění

2018

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

Metals

ISSN

2075-4701

e-ISSN

—

Svazek periodika

8

Číslo periodika v rámci svazku

4

Stát vydavatele periodika

CH - Švýcarská konfederace

Počet stran výsledku

17

Strana od-do

2075-4701

Kód UT WoS článku

000434882800077

EID výsledku v databázi Scopus

2-s2.0-85045745204