Direct Ultrasonic Soldering of AlN Ceramics with Copper Substrate Using Zn-Al-Mg Solder

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F61989100%3A27360%2F20%3A10245741" target="_blank" >RIV/61989100:27360/20:10245741 - isvavai.cz</a>

Výsledek na webu

<a href="https://www.mdpi.com/2075-4701/10/2/160" target="_blank" >https://www.mdpi.com/2075-4701/10/2/160</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.3390/met10020160" target="_blank" >10.3390/met10020160</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Direct Ultrasonic Soldering of AlN Ceramics with Copper Substrate Using Zn-Al-Mg Solder

Popis výsledku v původním jazyce

This research aims to develop the direct soldering of aluminum nitride (AlN) ceramics with a copper substrate using Zn-Al-Mg solder. The solder type, Zn5Al3Mg, has a close-to eutectic composition with a melting point of 359 degrees C. The microstructure of Zn-Al-Mg solder is composed of solid solution (Al), solid solution (Zn), an Mg2Zn11 phase and a minority MgZn2 phase. The tensile strength is from 82 to 169 MPa and depends on the magnesium content. The bond with AlN ceramics is formed due to the interaction of active Zn, Al and Mg metals with the substrate surface without forming a new transition phase. Zn and Al elements exert a substantial effect on bond formation with the Cu substrate. Magnesium does not contribute to bond formation with the Cu substrate. Two new phases, CuZn4-epsilon and Cu33Al17/Cu9Al4/Cu5Zn8-gamma, were observed, and form the transition zone of the joint. The maximum shear strength of the AlN/Cu joint fabricated using Zn5Al3Mg solder is 47 MPa. The maximum shear strength of the Cu/Cu joint fabricated using the same solder is 93 MPa.

Název v anglickém jazyce

Direct Ultrasonic Soldering of AlN Ceramics with Copper Substrate Using Zn-Al-Mg Solder

Popis výsledku anglicky

This research aims to develop the direct soldering of aluminum nitride (AlN) ceramics with a copper substrate using Zn-Al-Mg solder. The solder type, Zn5Al3Mg, has a close-to eutectic composition with a melting point of 359 degrees C. The microstructure of Zn-Al-Mg solder is composed of solid solution (Al), solid solution (Zn), an Mg2Zn11 phase and a minority MgZn2 phase. The tensile strength is from 82 to 169 MPa and depends on the magnesium content. The bond with AlN ceramics is formed due to the interaction of active Zn, Al and Mg metals with the substrate surface without forming a new transition phase. Zn and Al elements exert a substantial effect on bond formation with the Cu substrate. Magnesium does not contribute to bond formation with the Cu substrate. Two new phases, CuZn4-epsilon and Cu33Al17/Cu9Al4/Cu5Zn8-gamma, were observed, and form the transition zone of the joint. The maximum shear strength of the AlN/Cu joint fabricated using Zn5Al3Mg solder is 47 MPa. The maximum shear strength of the Cu/Cu joint fabricated using the same solder is 93 MPa.

Druh

J_imp - Článek v periodiku v databázi Web of Science

CEP obor

—

OECD FORD obor

20500 - Materials engineering

Projekt

—

Návaznosti

I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Rok uplatnění

2020

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

Metals

ISSN

2075-4701

e-ISSN

—

Svazek periodika

10

Číslo periodika v rámci svazku

2

Stát vydavatele periodika

CH - Švýcarská konfederace

Počet stran výsledku

18

Strana od-do

160

Kód UT WoS článku

000522450800005

EID výsledku v databázi Scopus

2-s2.0-85078537886