Research on joining metal-ceramics composite Al/Al2O3 with Cu substrate using solder type Zn-In-Mg
Identifikátory výsledku
Kód výsledku v IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F61989100%3A27360%2F19%3A10242425" target="_blank" >RIV/61989100:27360/19:10242425 - isvavai.cz</a>
Výsledek na webu
<a href="https://journals.sagepub.com/doi/abs/10.1177/0021998319835304" target="_blank" >https://journals.sagepub.com/doi/abs/10.1177/0021998319835304</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1177/0021998319835304" target="_blank" >10.1177/0021998319835304</a>
Alternativní jazyky
Jazyk výsledku
angličtina
Název v původním jazyce
Research on joining metal-ceramics composite Al/Al2O3 with Cu substrate using solder type Zn-In-Mg
Popis výsledku v původním jazyce
The study aimed at direct flux-free soldering of metal-ceramics composite (MMC) with a copper substrate. Soldering was performed with type Zn10In1Mg Zn-solder. The soldered joints were fabricated using power ultrasound. The solder used consists of a zinc matrix, while the solid solution (In) and MgZn2 phase were segregated on the grain boundaries. The soldered MMC joint is formed due to dissolution of the aluminium matrix in zinc solder. A new composite, composed of matrix consisting mainly of solid solution (Al) is thus formed. Moreover, there is also a solid solution present (In) and Cu3.2Zn0.7Al4.2 phase. The bond with copper substrate is formed due to interaction of Zn and Al from the solder at formation of two transient phases, namely Cu3.2Zn0.7Al4.2 and an unstable phase of Al(Cu,Zn)(2). The average shear strength of combined joints of MMC/Cu is 16.5 MPa.
Název v anglickém jazyce
Research on joining metal-ceramics composite Al/Al2O3 with Cu substrate using solder type Zn-In-Mg
Popis výsledku anglicky
The study aimed at direct flux-free soldering of metal-ceramics composite (MMC) with a copper substrate. Soldering was performed with type Zn10In1Mg Zn-solder. The soldered joints were fabricated using power ultrasound. The solder used consists of a zinc matrix, while the solid solution (In) and MgZn2 phase were segregated on the grain boundaries. The soldered MMC joint is formed due to dissolution of the aluminium matrix in zinc solder. A new composite, composed of matrix consisting mainly of solid solution (Al) is thus formed. Moreover, there is also a solid solution present (In) and Cu3.2Zn0.7Al4.2 phase. The bond with copper substrate is formed due to interaction of Zn and Al from the solder at formation of two transient phases, namely Cu3.2Zn0.7Al4.2 and an unstable phase of Al(Cu,Zn)(2). The average shear strength of combined joints of MMC/Cu is 16.5 MPa.
Klasifikace
Druh
J<sub>imp</sub> - Článek v periodiku v databázi Web of Science
CEP obor
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OECD FORD obor
20500 - Materials engineering
Návaznosti výsledku
Projekt
—
Návaznosti
I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace
Ostatní
Rok uplatnění
2019
Kód důvěrnosti údajů
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Údaje specifické pro druh výsledku
Název periodika
Journal of composite materials
ISSN
0021-9983
e-ISSN
—
Svazek periodika
53
Číslo periodika v rámci svazku
10
Stát vydavatele periodika
GB - Spojené království Velké Británie a Severního Irska
Počet stran výsledku
12
Strana od-do
1411-1422
Kód UT WoS článku
000462777800012
EID výsledku v databázi Scopus
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