Characterizing the Soldering Alloy Type Zn-Al-Cu and Study of Ultrasonic Soldering of Al7075/Cu Combination

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F61989100%3A27360%2F21%3A10247309" target="_blank" >RIV/61989100:27360/21:10247309 - isvavai.cz</a>

Výsledek na webu

<a href="https://www.mdpi.com/2075-4701/11/1/27/htm" target="_blank" >https://www.mdpi.com/2075-4701/11/1/27/htm</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.3390/met11010027" target="_blank" >10.3390/met11010027</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Characterizing the Soldering Alloy Type Zn-Al-Cu and Study of Ultrasonic Soldering of Al7075/Cu Combination

Popis výsledku v původním jazyce

The aim of the research was to characterize the soldering alloy type Zn-Al-Cu and study the fluxless ultrasonic soldering of the combination of aluminum alloy type Al7075 with copper substrate. The Zn-Al-Cu solder is of the close-to-eutectic type with two phase transformations: the eutectic transformation at 378 degrees C and the eutectoid transformation at 285 degrees C. The solder microstructure is formed of a matrix composed of the solid solutions of aluminum (Al) and zinc (Zn) in which the copper phases CuZn4 and CuAl2 are precipitated. The shear strength of the soldering alloy type Zn5Al with copper addition reaches values from 167 to 187 MPa and it depends on the copper content in the solder. The bond with aluminum alloy type Al7075 is formed due to the solubility of Al in zinc solder at the formation of solid solution Al. Contrary to this observation, the bond with the copper substrate is in this case formed due to the interaction of zinc and aluminum with the copper substrate. Two new intermetallic phases, namely Al(Cu,Zn)(2) and Cu3.2Zn0.7Al4.2, were formed. The average shear strength of Al7075/Zn5Al3Cu/Cu joints attained was 134.5 MPa. For comparison, the Cu/Zn5Al3Cu/Cu joint attained an average shear strength of 136.5 MPa.

Název v anglickém jazyce

Characterizing the Soldering Alloy Type Zn-Al-Cu and Study of Ultrasonic Soldering of Al7075/Cu Combination

Popis výsledku anglicky

The aim of the research was to characterize the soldering alloy type Zn-Al-Cu and study the fluxless ultrasonic soldering of the combination of aluminum alloy type Al7075 with copper substrate. The Zn-Al-Cu solder is of the close-to-eutectic type with two phase transformations: the eutectic transformation at 378 degrees C and the eutectoid transformation at 285 degrees C. The solder microstructure is formed of a matrix composed of the solid solutions of aluminum (Al) and zinc (Zn) in which the copper phases CuZn4 and CuAl2 are precipitated. The shear strength of the soldering alloy type Zn5Al with copper addition reaches values from 167 to 187 MPa and it depends on the copper content in the solder. The bond with aluminum alloy type Al7075 is formed due to the solubility of Al in zinc solder at the formation of solid solution Al. Contrary to this observation, the bond with the copper substrate is in this case formed due to the interaction of zinc and aluminum with the copper substrate. Two new intermetallic phases, namely Al(Cu,Zn)(2) and Cu3.2Zn0.7Al4.2, were formed. The average shear strength of Al7075/Zn5Al3Cu/Cu joints attained was 134.5 MPa. For comparison, the Cu/Zn5Al3Cu/Cu joint attained an average shear strength of 136.5 MPa.

Druh

J_imp - Článek v periodiku v databázi Web of Science

CEP obor

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OECD FORD obor

20500 - Materials engineering

Projekt

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Návaznosti

I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Rok uplatnění

2021

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

Metals

ISSN

2075-4701

e-ISSN

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Svazek periodika

11

Číslo periodika v rámci svazku

1

Stát vydavatele periodika

CH - Švýcarská konfederace

Počet stran výsledku

17

Strana od-do

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Kód UT WoS článku

000610504500001

EID výsledku v databázi Scopus

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