Silicon Oxide Films: Plasma Assisted Formation of Nanostructures from Glass to Organic Polymers
Identifikátory výsledku
Kód výsledku v IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216224%3A14310%2F16%3A00097404" target="_blank" >RIV/00216224:14310/16:00097404 - isvavai.cz</a>
Výsledek na webu
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DOI - Digital Object Identifier
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Alternativní jazyky
Jazyk výsledku
angličtina
Název v původním jazyce
Silicon Oxide Films: Plasma Assisted Formation of Nanostructures from Glass to Organic Polymers
Popis výsledku v původním jazyce
Thin silicon oxide films produced by means of plasma enhanced deposition techniques cover a large area of applications with a long industrial tradition. It is long-recognized that the chemical composition, physical properties and particularly the functionalisation of SiOx films can be adjusted in a wide range by choosing the appropriate plasma conditions for the deposition process. For PECVD, the proper choice of the silicon-organic molecule as thin film precursor is also substantial. Next to the production of amorphous SiO2films by PVD for optical coatings, also SiOx films by PECVD are known that mimic the functionality of a glass surface. Prominent examples include films for corrosion protection, as passivation and insulation layer, and for permeation barrier coatings. Here, dense, pin-hole free films are required that are usually characterized by a stoichiometry close to x=2, with low carbon content (below 5%). With increasing polymeric character and depending on the degree of cross-linking the films become attractive for applications such as adhesion promoting interfaces in multilayer systems, for the integration of catalysts into surfaces or as selective absorber in sensor applications. For these purposes, films with micro- and nano-porous morphologies are preferred.
Název v anglickém jazyce
Silicon Oxide Films: Plasma Assisted Formation of Nanostructures from Glass to Organic Polymers
Popis výsledku anglicky
Thin silicon oxide films produced by means of plasma enhanced deposition techniques cover a large area of applications with a long industrial tradition. It is long-recognized that the chemical composition, physical properties and particularly the functionalisation of SiOx films can be adjusted in a wide range by choosing the appropriate plasma conditions for the deposition process. For PECVD, the proper choice of the silicon-organic molecule as thin film precursor is also substantial. Next to the production of amorphous SiO2films by PVD for optical coatings, also SiOx films by PECVD are known that mimic the functionality of a glass surface. Prominent examples include films for corrosion protection, as passivation and insulation layer, and for permeation barrier coatings. Here, dense, pin-hole free films are required that are usually characterized by a stoichiometry close to x=2, with low carbon content (below 5%). With increasing polymeric character and depending on the degree of cross-linking the films become attractive for applications such as adhesion promoting interfaces in multilayer systems, for the integration of catalysts into surfaces or as selective absorber in sensor applications. For these purposes, films with micro- and nano-porous morphologies are preferred.
Klasifikace
Druh
O - Ostatní výsledky
CEP obor
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OECD FORD obor
10305 - Fluids and plasma physics (including surface physics)
Návaznosti výsledku
Projekt
Výsledek vznikl pri realizaci vícero projektů. Více informací v záložce Projekty.
Návaznosti
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)
Ostatní
Rok uplatnění
2016
Kód důvěrnosti údajů
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů