Mid-infrared integrated optics: versatile hot embossing of mid-infrared glasses for on-chip planar waveguides for molecular sensing

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216275%3A25310%2F14%3A39898659" target="_blank" >RIV/00216275:25310/14:39898659 - isvavai.cz</a>

Výsledek na webu

<a href="http://dx.doi.org/10.1117/1.OE.53.7.071824" target="_blank" >http://dx.doi.org/10.1117/1.OE.53.7.071824</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1117/1.OE.53.7.071824" target="_blank" >10.1117/1.OE.53.7.071824</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Mid-infrared integrated optics: versatile hot embossing of mid-infrared glasses for on-chip planar waveguides for molecular sensing

Popis výsledku v původním jazyce

The versatility of hot embossing for shaping photonic components on-chip for mid-infrared (IR) integrated optics, using a hard mold, is demonstrated. Hot embossing via fiber-on-glass (FOG), thermally evaporated films, and radio frequency (RF)-sputtered films on glass are described. Mixed approaches of combined plasma etching and hot embossing increase the versatility still further for engineering optical circuits on a single platform. Application of these methodologies for fabricating molecular-sensingdevices on-chip is discussed with a view to biomedical sensing. Future prospects for using photonic integration for the new field of mid-IR molecular sensing are appraised. Also, common methods of measuring waveguide optical loss are critically compared,regarding their susceptibility to artifacts which tend artificially to depress, or enhance, the waveguide optical loss.

Název v anglickém jazyce

Mid-infrared integrated optics: versatile hot embossing of mid-infrared glasses for on-chip planar waveguides for molecular sensing

Popis výsledku anglicky

The versatility of hot embossing for shaping photonic components on-chip for mid-infrared (IR) integrated optics, using a hard mold, is demonstrated. Hot embossing via fiber-on-glass (FOG), thermally evaporated films, and radio frequency (RF)-sputtered films on glass are described. Mixed approaches of combined plasma etching and hot embossing increase the versatility still further for engineering optical circuits on a single platform. Application of these methodologies for fabricating molecular-sensingdevices on-chip is discussed with a view to biomedical sensing. Future prospects for using photonic integration for the new field of mid-IR molecular sensing are appraised. Also, common methods of measuring waveguide optical loss are critically compared,regarding their susceptibility to artifacts which tend artificially to depress, or enhance, the waveguide optical loss.

Druh

J_x - Nezařazeno - Článek v odborném periodiku (Jimp, Jsc a Jost)

CEP obor

CA - Anorganická chemie

OECD FORD obor

—

Projekt

<a href="/cs/project/EE2.3.20.0254" target="_blank" >EE2.3.20.0254: Výzkumný tým pro pokročilé nekrystalické materiály</a><br>

Návaznosti

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Rok uplatnění

2014

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

Optical Engineering

ISSN

0091-3286

e-ISSN

—

Svazek periodika

53

Číslo periodika v rámci svazku

7

Stát vydavatele periodika

US - Spojené státy americké

Počet stran výsledku

9

Strana od-do

"071824-1"-"071824-9"

Kód UT WoS článku

000341183900018

EID výsledku v databázi Scopus

—