Low Temperature Atomic Layer Deposition of (00l)-Oriented Elemental Bismuth
Identifikátory výsledku
Kód výsledku v IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216275%3A25310%2F25%3A39923150" target="_blank" >RIV/00216275:25310/25:39923150 - isvavai.cz</a>
Výsledek na webu
<a href="https://doi.org/10.1002/anie.202422578" target="_blank" >https://doi.org/10.1002/anie.202422578</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1002/anie.202422578" target="_blank" >10.1002/anie.202422578</a>
Alternativní jazyky
Jazyk výsledku
angličtina
Název v původním jazyce
Low Temperature Atomic Layer Deposition of (00l)-Oriented Elemental Bismuth
Popis výsledku v původním jazyce
This study presents the first successful demonstration of growing elemental bismuth (Bi) thin films via thermal atomic layer deposition (ALD) using Bi(NMe2)3 as the precursor and Sb(SiMe3)3 as the co-reactant. The films were deposited at a relatively low temperature of 100 degrees C, with a growth per cycle (GPC) of 0.31-0.34 & Aring;/cycle. Island formation marked the initial growth stages, with surface coverage reaching around 80 % after 1000 cycles and full coverage between 2000 and 2500 cycles. Morphological analysis revealed that the Bi grains expanded and became more defined as the number of ALD cycles increased. This coalescence is further supported by X-ray diffraction (XRD) patterns, which show a preferential shift in growth orientation from the (012) plane to the (003) plane as the film thickness increases. X-ray photoemission spectroscopy (XPS) confirmed the presence of metallic Bi with minimal surface oxidation. Temperature-dependent sheet resistance measurements highlight the semimetallic nature of Bi, with a room temperature resistivity of approximate to 200 mu Omega cm for the 2500 cycles Bi. Temperature-dependent sheet resistance was also associated with a transition in carrier-type dominance from holes at higher temperatures to electrones at lower temperatures.
Název v anglickém jazyce
Low Temperature Atomic Layer Deposition of (00l)-Oriented Elemental Bismuth
Popis výsledku anglicky
This study presents the first successful demonstration of growing elemental bismuth (Bi) thin films via thermal atomic layer deposition (ALD) using Bi(NMe2)3 as the precursor and Sb(SiMe3)3 as the co-reactant. The films were deposited at a relatively low temperature of 100 degrees C, with a growth per cycle (GPC) of 0.31-0.34 & Aring;/cycle. Island formation marked the initial growth stages, with surface coverage reaching around 80 % after 1000 cycles and full coverage between 2000 and 2500 cycles. Morphological analysis revealed that the Bi grains expanded and became more defined as the number of ALD cycles increased. This coalescence is further supported by X-ray diffraction (XRD) patterns, which show a preferential shift in growth orientation from the (012) plane to the (003) plane as the film thickness increases. X-ray photoemission spectroscopy (XPS) confirmed the presence of metallic Bi with minimal surface oxidation. Temperature-dependent sheet resistance measurements highlight the semimetallic nature of Bi, with a room temperature resistivity of approximate to 200 mu Omega cm for the 2500 cycles Bi. Temperature-dependent sheet resistance was also associated with a transition in carrier-type dominance from holes at higher temperatures to electrones at lower temperatures.
Klasifikace
Druh
J<sub>imp</sub> - Článek v periodiku v databázi Web of Science
CEP obor
—
OECD FORD obor
10403 - Physical chemistry
Návaznosti výsledku
Projekt
—
Návaznosti
I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace
Ostatní
Rok uplatnění
2025
Kód důvěrnosti údajů
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Údaje specifické pro druh výsledku
Název periodika
Angewandte Chemie (International Edition)
ISSN
1433-7851
e-ISSN
1521-3773
Svazek periodika
64
Číslo periodika v rámci svazku
15
Stát vydavatele periodika
DE - Spolková republika Německo
Počet stran výsledku
14
Strana od-do
"e202422578"
Kód UT WoS článku
001420643100001
EID výsledku v databázi Scopus
2-s2.0-105002179181