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Electron sensitivity, photosensitivity and thermoplasticity of copper-doped Ge25Se75 thin films prepared via spin-coating

Identifikátory výsledku

  • Kód výsledku v IS VaVaI

    <a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216275%3A25310%2F25%3A39923188" target="_blank" >RIV/00216275:25310/25:39923188 - isvavai.cz</a>

  • Nalezeny alternativní kódy

    RIV/00216208:11320/25:10508644

  • Výsledek na webu

    <a href="https://doi.org/10.1016/j.apsusc.2025.163848" target="_blank" >https://doi.org/10.1016/j.apsusc.2025.163848</a>

  • DOI - Digital Object Identifier

    <a href="http://dx.doi.org/10.1016/j.apsusc.2025.163848" target="_blank" >10.1016/j.apsusc.2025.163848</a>

Alternativní jazyky

  • Jazyk výsledku

    angličtina

  • Název v původním jazyce

    Electron sensitivity, photosensitivity and thermoplasticity of copper-doped Ge25Se75 thin films prepared via spin-coating

  • Popis výsledku v původním jazyce

    Copper-doped Ge25Se75 thin films were deposited via spin-coating using anhydrous copper(I) or copper(II) chloride precursors to examine the effects of Cu oxidation states on film properties. The solution processing offered a cost-effective route with a mass production potential of perspective Cu-doped chalcogenide materials. The Energy-dispersive X-ray spectroscopy (EDX) and X-ray photoelectron spectroscopy (XPS) techniques confirmed the Cu incorporation at its targeted concentration (5 at.%). The XPS also revealed a reduction of Cu2+ to Cu+ oxidation form, presumably already in the solution phase. Optical characterisation revealed a redshift in the bandgap due to Cu-Se bond formation while annealing at 210 degrees C led to partial crystallisation, forming CuGeSex-like phases. The combination of wet etching with electron beam lithography and optical holography showed a significant increase in the stability of copper-doped material. Similarly, the thermoplasticity of copper-doped samples was affected as the hot embossing temperature dramatically shifted towards higher temperatures. However, despite having the same Cu+ oxidation state, the selected copper precursor still significantly influenced the majority of studied phenomena. These findings prove that Cu doping in the solution phase modifies the optical, mechanical and potentially electrical properties of Ge25Se75 thin films, making them viable for resistive memory or high-temperature photonic applications.

  • Název v anglickém jazyce

    Electron sensitivity, photosensitivity and thermoplasticity of copper-doped Ge25Se75 thin films prepared via spin-coating

  • Popis výsledku anglicky

    Copper-doped Ge25Se75 thin films were deposited via spin-coating using anhydrous copper(I) or copper(II) chloride precursors to examine the effects of Cu oxidation states on film properties. The solution processing offered a cost-effective route with a mass production potential of perspective Cu-doped chalcogenide materials. The Energy-dispersive X-ray spectroscopy (EDX) and X-ray photoelectron spectroscopy (XPS) techniques confirmed the Cu incorporation at its targeted concentration (5 at.%). The XPS also revealed a reduction of Cu2+ to Cu+ oxidation form, presumably already in the solution phase. Optical characterisation revealed a redshift in the bandgap due to Cu-Se bond formation while annealing at 210 degrees C led to partial crystallisation, forming CuGeSex-like phases. The combination of wet etching with electron beam lithography and optical holography showed a significant increase in the stability of copper-doped material. Similarly, the thermoplasticity of copper-doped samples was affected as the hot embossing temperature dramatically shifted towards higher temperatures. However, despite having the same Cu+ oxidation state, the selected copper precursor still significantly influenced the majority of studied phenomena. These findings prove that Cu doping in the solution phase modifies the optical, mechanical and potentially electrical properties of Ge25Se75 thin films, making them viable for resistive memory or high-temperature photonic applications.

Klasifikace

  • Druh

    J<sub>imp</sub> - Článek v periodiku v databázi Web of Science

  • CEP obor

  • OECD FORD obor

    20506 - Coating and films

Návaznosti výsledku

  • Projekt

    <a href="/cs/project/EH22_008%2F0004591" target="_blank" >EH22_008/0004591: Feroické multifunkcionality</a><br>

  • Návaznosti

Ostatní

  • Rok uplatnění

    2025

  • Kód důvěrnosti údajů

    S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Údaje specifické pro druh výsledku

  • Název periodika

    Applied Surface Science

  • ISSN

    0169-4332

  • e-ISSN

    1873-5584

  • Svazek periodika

    709

  • Číslo periodika v rámci svazku

    November 2025

  • Stát vydavatele periodika

    NL - Nizozemsko

  • Počet stran výsledku

    13

  • Strana od-do

    163848

  • Kód UT WoS článku

    001520603800001

  • EID výsledku v databázi Scopus

    2-s2.0-105008500477