Nové poznatky z aplikací bezolovnatých pájek

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F04%3APU45693" target="_blank" >RIV/00216305:26220/04:PU45693 - isvavai.cz</a>

Výsledek na webu

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DOI - Digital Object Identifier

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Jazyk výsledku

angličtina

Název v původním jazyce

Some New Results from Investigation of Lead-free Solders Application

Popis výsledku v původním jazyce

This paper deals with some aspects of solder joint quality in context with introduction of Pb-free solder compounds in EU legislation. It is provided by ecological norms (ECO) and other related norms (i.e. WEEE ? Waste Electrical and Electronic Equipmentand RoHS ? Restriction of use of certain Hazardous Substances). The date 1st of July 2006 is nearer and there isn?t clear, which of Pb-free systems will definitively replace SnPb materials with correspondent success. Many factors have to be valuated inthis context and that needs some knowledge about materials and process compatibility in different industrial conditions. One of the most important is wettability and spreadability, which is closed to many factors. Material select.,ion for soldering process has to be compatible for having the best results in wetting characteristics, solder joint formation, and final solder joint reliability. Material compatibility includes selection type of fluxes, soldering atmosphere, solder alloy compo

Název v anglickém jazyce

Some New Results from Investigation of Lead-free Solders Application

Popis výsledku anglicky

This paper deals with some aspects of solder joint quality in context with introduction of Pb-free solder compounds in EU legislation. It is provided by ecological norms (ECO) and other related norms (i.e. WEEE ? Waste Electrical and Electronic Equipmentand RoHS ? Restriction of use of certain Hazardous Substances). The date 1st of July 2006 is nearer and there isn?t clear, which of Pb-free systems will definitively replace SnPb materials with correspondent success. Many factors have to be valuated inthis context and that needs some knowledge about materials and process compatibility in different industrial conditions. One of the most important is wettability and spreadability, which is closed to many factors. Material select.,ion for soldering process has to be compatible for having the best results in wetting characteristics, solder joint formation, and final solder joint reliability. Material compatibility includes selection type of fluxes, soldering atmosphere, solder alloy compo

Druh

D - Stať ve sborníku

CEP obor

JA - Elektronika a optoelektronika, elektrotechnika

OECD FORD obor

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Projekt

<a href="/cs/project/GA102%2F04%2F0590" target="_blank" >GA102/04/0590: Vývoj mikroelektronických montážních technologií pro 3D obvody a systémy</a><br>

Návaznosti

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Rok uplatnění

2004

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

Proceedings of IMAPS Nordic 2004 Annual Conference

ISBN

951-98002-6-3

ISSN

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e-ISSN

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Počet stran výsledku

7

Strana od-do

49-55

Název nakladatele

IMAPS Nordic

Místo vydání

Helsingor, Denmark

Místo konání akce

Helsingor

Datum konání akce

26. 9. 2004

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

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