The Properties Comparison of Solder Joints on Ceramic and FR-4 Substrates

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F12%3APU101021" target="_blank" >RIV/00216305:26220/12:PU101021 - isvavai.cz</a>

Výsledek na webu

<a href="http://www.estc2012.eu" target="_blank" >http://www.estc2012.eu</a>

DOI - Digital Object Identifier

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Jazyk výsledku

angličtina

Název v původním jazyce

The Properties Comparison of Solder Joints on Ceramic and FR-4 Substrates

Popis výsledku v původním jazyce

Reliability of electro-technical products is still a highly actual and discussed topic. Every electro-technical product consists not only of the components, functional blocks and systems, but also substrate as printed circuit board (PCB) or ceramic substrates, which are interconnected by solder joints. This article is focuses on a comparison of some properties of solder joints on ceramic and PCB substrates. Standard aluminum oxide ceramics (corundum) with thickness t = 0.65 mm was used as the ceramic substrate. Standard FR-4 board with a thickness t = 1.5 mm was used as the PCB substrate. This paper compares the main strength of solder joint at various concentrations of O2, type solders (SnPb, SnAgCu, ...), the size of components (0402, 0603, 2512, ...) and material surfaces. Shear test equipment DAGE was used to compare the mechanical strength.

Název v anglickém jazyce

The Properties Comparison of Solder Joints on Ceramic and FR-4 Substrates

Popis výsledku anglicky

Reliability of electro-technical products is still a highly actual and discussed topic. Every electro-technical product consists not only of the components, functional blocks and systems, but also substrate as printed circuit board (PCB) or ceramic substrates, which are interconnected by solder joints. This article is focuses on a comparison of some properties of solder joints on ceramic and PCB substrates. Standard aluminum oxide ceramics (corundum) with thickness t = 0.65 mm was used as the ceramic substrate. Standard FR-4 board with a thickness t = 1.5 mm was used as the PCB substrate. This paper compares the main strength of solder joint at various concentrations of O2, type solders (SnPb, SnAgCu, ...), the size of components (0402, 0603, 2512, ...) and material surfaces. Shear test equipment DAGE was used to compare the mechanical strength.

Druh

D - Stať ve sborníku

CEP obor

JA - Elektronika a optoelektronika, elektrotechnika

OECD FORD obor

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Projekt

<a href="/cs/project/2A-1TP1%2F143" target="_blank" >2A-1TP1/143: Výzkum nových mechatronických struktur MEMS využitelných pro měření tlaku.</a><br>

Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2012

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

4TH ELECTRONICS SYSTEM INTEGRATION TECHNOLOGIES CONFERENCE ESTC 2012

ISBN

978-1-4673-4644-3

ISSN

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e-ISSN

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Počet stran výsledku

5

Strana od-do

1-5

Název nakladatele

Medicongress, Kloosterstraat 5, B-9960 Assenede, Belgium

Místo vydání

Amsterdam, NL

Místo konání akce

Amsterdam RAI

Datum konání akce

17. 9. 2012

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

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