Thermal Shock Ageing of Joints Soldered Using Formic Acid Vapors on Thick Printed Copper Substrates

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F23%3A43968762" target="_blank" >RIV/49777513:23220/23:43968762 - isvavai.cz</a>

Výsledek na webu

<a href="https://ieeexplore.ieee.org/document/10168336" target="_blank" >https://ieeexplore.ieee.org/document/10168336</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/ISSE57496.2023.10168336" target="_blank" >10.1109/ISSE57496.2023.10168336</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Thermal Shock Ageing of Joints Soldered Using Formic Acid Vapors on Thick Printed Copper Substrates

Popis výsledku v původním jazyce

This article addresses the soldering of larger components onto ceramic substrates with printed copper patterns with a reduced amount of flux. The main aim of the research was to find a suitable soldering method and study the reliability of soldered joints on ceramic substrates under thermal shock ageing. The mock-up chips were used in the test and for this reason the test was primarily focused on bottom joint in the structure or sandwich structures. In the experiment, vacuum soldering using formic acid vapors to reduce oxides was used. Then the samples were observed under X-RAY radiation and submitted for thermal shock testing (-40 °C / 125° C / 1000 cycles). After the shock testing, another X-RAY scan with void area measurement and shear strength testing were realized. The results showed that our contacting soldering process on ceramic substrates is applicable and the samples also endures the shock ageing, especially bottom joint between ceramic substrate with Cu layer and solder alloy. The results also showed that void area and mechanical shear strength of soldered ceramic samples are relatively comparable with standard samples (FR-4).

Název v anglickém jazyce

Thermal Shock Ageing of Joints Soldered Using Formic Acid Vapors on Thick Printed Copper Substrates

Popis výsledku anglicky

This article addresses the soldering of larger components onto ceramic substrates with printed copper patterns with a reduced amount of flux. The main aim of the research was to find a suitable soldering method and study the reliability of soldered joints on ceramic substrates under thermal shock ageing. The mock-up chips were used in the test and for this reason the test was primarily focused on bottom joint in the structure or sandwich structures. In the experiment, vacuum soldering using formic acid vapors to reduce oxides was used. Then the samples were observed under X-RAY radiation and submitted for thermal shock testing (-40 °C / 125° C / 1000 cycles). After the shock testing, another X-RAY scan with void area measurement and shear strength testing were realized. The results showed that our contacting soldering process on ceramic substrates is applicable and the samples also endures the shock ageing, especially bottom joint between ceramic substrate with Cu layer and solder alloy. The results also showed that void area and mechanical shear strength of soldered ceramic samples are relatively comparable with standard samples (FR-4).

Druh

D - Stať ve sborníku

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

—

Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2023

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

Proceedings of the International Spring Seminar on Electronics Technology

ISBN

979-8-3503-3484-5

ISSN

—

e-ISSN

2161-2536

Počet stran výsledku

4

Strana od-do

—

Název nakladatele

IEEE

Místo vydání

Piscaway

Místo konání akce

Timisoara, Romania

Datum konání akce

10. 5. 2023

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

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