Comparison of Gold-Plated PCB Finishes after Thermal Stress
Identifikátory výsledku
Kód výsledku v IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F21%3A00350943" target="_blank" >RIV/68407700:21230/21:00350943 - isvavai.cz</a>
Výsledek na webu
<a href="https://doi.org/10.1109/ISSE51996.2021.9467593" target="_blank" >https://doi.org/10.1109/ISSE51996.2021.9467593</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE51996.2021.9467593" target="_blank" >10.1109/ISSE51996.2021.9467593</a>
Alternativní jazyky
Jazyk výsledku
angličtina
Název v původním jazyce
Comparison of Gold-Plated PCB Finishes after Thermal Stress
Popis výsledku v původním jazyce
The article deals with thermal cycling influence on the electrical and mechanical properties of the soldered joint on various gold-plated surfaces. The purpose was to determine the effect of thermal aging on the properties of the soldered joint of Galvanic Gold and Electroless Nickel Immersion Gold (ENIG) surface finishes and two lead-free solder alloys SAC305 NC257-2 and SAC305 M8. Two different heating factors of limit values - minimum value of 218 s°C at which the solder is still possible to reflow and a maximum value of 2295 s°C which still fits to the manufacturer's specifications - were used for reflow process of used solders. Prepared samples were thermally cycled in a shock test chamber (-40°C, +125°C) or aged at 85°C and 85% RH (HH, Heat-Humidity chamber). The results show the influence of shock temperatures on the shear strength and resistance of soldered joints. The shear strength decreased after 1000 thermal cycles by 40% and soldered joints reflowed with a higher heating factor were stronger than the soldered joints reflowed with a lower heating factor. In contrast to shock temperatures, HH test did not have a significant effect on shear strength.
Název v anglickém jazyce
Comparison of Gold-Plated PCB Finishes after Thermal Stress
Popis výsledku anglicky
The article deals with thermal cycling influence on the electrical and mechanical properties of the soldered joint on various gold-plated surfaces. The purpose was to determine the effect of thermal aging on the properties of the soldered joint of Galvanic Gold and Electroless Nickel Immersion Gold (ENIG) surface finishes and two lead-free solder alloys SAC305 NC257-2 and SAC305 M8. Two different heating factors of limit values - minimum value of 218 s°C at which the solder is still possible to reflow and a maximum value of 2295 s°C which still fits to the manufacturer's specifications - were used for reflow process of used solders. Prepared samples were thermally cycled in a shock test chamber (-40°C, +125°C) or aged at 85°C and 85% RH (HH, Heat-Humidity chamber). The results show the influence of shock temperatures on the shear strength and resistance of soldered joints. The shear strength decreased after 1000 thermal cycles by 40% and soldered joints reflowed with a higher heating factor were stronger than the soldered joints reflowed with a lower heating factor. In contrast to shock temperatures, HH test did not have a significant effect on shear strength.
Klasifikace
Druh
D - Stať ve sborníku
CEP obor
—
OECD FORD obor
20201 - Electrical and electronic engineering
Návaznosti výsledku
Projekt
—
Návaznosti
S - Specificky vyzkum na vysokych skolach
Ostatní
Rok uplatnění
2021
Kód důvěrnosti údajů
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Údaje specifické pro druh výsledku
Název statě ve sborníku
2021 44th International Spring Seminar on Electronics Technology (ISSE)
ISBN
978-1-6654-1477-7
ISSN
—
e-ISSN
2161-2528
Počet stran výsledku
5
Strana od-do
—
Název nakladatele
IEEE Press
Místo vydání
New York
Místo konání akce
Bautzen
Datum konání akce
5. 5. 2021
Typ akce podle státní příslušnosti
WRD - Celosvětová akce
Kód UT WoS článku
—