Evaluation of Long-term Stability of Bismuth-Tin Solder Joint Properties in Dependence on Reflow Conditions

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F21%3A00350914" target="_blank" >RIV/68407700:21230/21:00350914 - isvavai.cz</a>

Výsledek na webu

<a href="https://doi.org/10.1109/ISSE51996.2021.9467630" target="_blank" >https://doi.org/10.1109/ISSE51996.2021.9467630</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/ISSE51996.2021.9467630" target="_blank" >10.1109/ISSE51996.2021.9467630</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Evaluation of Long-term Stability of Bismuth-Tin Solder Joint Properties in Dependence on Reflow Conditions

Popis výsledku v původním jazyce

This work aimed to evaluate the change of properties of joints based on bismuth-tin eutectic alloy soldered under various reflow conditions during long-term accelerated aging tests. Four temperature profiles were used for the reflow soldering of testing boards. The profiles differed in the reflow phase and the pre-heat phase when the soldering flux is activated. Subsequently, the first half of the testing boards was aged for 1000 hours in a climatic chamber at 85 °C and relative humidity 85 %. The second half was closed up in a temperature-shock chamber for 1000 cycles with the following settings: a hot temperature of 125 °C, a cold temperature of -40 °C, and a cycle time of 30 minutes. The solder joint properties - electrical resistance, shear strength, and thickness of intermetallic layers - were measured four times during the aging to observe trends. It turned out from the measurement results that the most stable during temperature-humidity aging were the joints soldered with higher temperature in the pre-heat phase and lower temperature in the reflow phase. On the contrary, the joints soldered with a lower temperature in the pre-heat phase and a higher temperature in the reflow phase were more resistant against the thermal shocks. The shear strength was even higher than before the start of the test. Overall, both pre-heat and reflow settings play an important role in solder joint reliability.

Název v anglickém jazyce

Evaluation of Long-term Stability of Bismuth-Tin Solder Joint Properties in Dependence on Reflow Conditions

Popis výsledku anglicky

This work aimed to evaluate the change of properties of joints based on bismuth-tin eutectic alloy soldered under various reflow conditions during long-term accelerated aging tests. Four temperature profiles were used for the reflow soldering of testing boards. The profiles differed in the reflow phase and the pre-heat phase when the soldering flux is activated. Subsequently, the first half of the testing boards was aged for 1000 hours in a climatic chamber at 85 °C and relative humidity 85 %. The second half was closed up in a temperature-shock chamber for 1000 cycles with the following settings: a hot temperature of 125 °C, a cold temperature of -40 °C, and a cycle time of 30 minutes. The solder joint properties - electrical resistance, shear strength, and thickness of intermetallic layers - were measured four times during the aging to observe trends. It turned out from the measurement results that the most stable during temperature-humidity aging were the joints soldered with higher temperature in the pre-heat phase and lower temperature in the reflow phase. On the contrary, the joints soldered with a lower temperature in the pre-heat phase and a higher temperature in the reflow phase were more resistant against the thermal shocks. The shear strength was even higher than before the start of the test. Overall, both pre-heat and reflow settings play an important role in solder joint reliability.

Druh

D - Stať ve sborníku

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

—

Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2021

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

2021 44th International Spring Seminar on Electronics Technology (ISSE)

ISBN

978-1-6654-1477-7

ISSN

—

e-ISSN

2161-2528

Počet stran výsledku

7

Strana od-do

1-7

Název nakladatele

IEEE Press

Místo vydání

New York

Místo konání akce

Bautzen

Datum konání akce

5. 5. 2021

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

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