Comparison of Gold-Plated PCB Finishes

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F20%3A00342442" target="_blank" >RIV/68407700:21230/20:00342442 - isvavai.cz</a>

Výsledek na webu

<a href="https://doi.org/10.1109/ISSE49702.2020.9121062" target="_blank" >https://doi.org/10.1109/ISSE49702.2020.9121062</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/ISSE49702.2020.9121062" target="_blank" >10.1109/ISSE49702.2020.9121062</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Comparison of Gold-Plated PCB Finishes

Popis výsledku v původním jazyce

In this work, two surface finishes - Electroless Nickel Immersion Gold (ENIG) and Galvanic Gold were compared. Solder joints were tested with respect to used materials (ENIG and Galvanic Gold finishes, lead-free solders SAC305 M8, SAC305 NC257-2), used technologies (heating factor of 218 s°C and 2295 s°C). The resistance of soldered joints was measured on prepared samples. The measurement results showed the influence of the heating factor on the resistance of soldered joints. With a heating factor of 218 s°C, the resistance of the joint is higher than that of a soldered joint realized using a higher heating factor, except for samples with a galvanic coating. A destructive shear strength test was also conducted. The results showed that heating factor may affect reliability of the soldered joint as the shear strength is influenced. In the case of SAC305 M8 solder, the shear strength values of the soldered joints with heating factor of 2295 s°C are approximately 21% higher, with the exception of the sample with half thickness of the standard thickness of ENIG surface finish. The SAC305 NC257-2 solder does not have big differences in shear strength at lower and higher heating factors during reflow.

Název v anglickém jazyce

Comparison of Gold-Plated PCB Finishes

Popis výsledku anglicky

In this work, two surface finishes - Electroless Nickel Immersion Gold (ENIG) and Galvanic Gold were compared. Solder joints were tested with respect to used materials (ENIG and Galvanic Gold finishes, lead-free solders SAC305 M8, SAC305 NC257-2), used technologies (heating factor of 218 s°C and 2295 s°C). The resistance of soldered joints was measured on prepared samples. The measurement results showed the influence of the heating factor on the resistance of soldered joints. With a heating factor of 218 s°C, the resistance of the joint is higher than that of a soldered joint realized using a higher heating factor, except for samples with a galvanic coating. A destructive shear strength test was also conducted. The results showed that heating factor may affect reliability of the soldered joint as the shear strength is influenced. In the case of SAC305 M8 solder, the shear strength values of the soldered joints with heating factor of 2295 s°C are approximately 21% higher, with the exception of the sample with half thickness of the standard thickness of ENIG surface finish. The SAC305 NC257-2 solder does not have big differences in shear strength at lower and higher heating factors during reflow.

Druh

D - Stať ve sborníku

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

—

Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2020

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

2020 43rd International Spring Seminar on Electronics Technology (ISSE)

ISBN

978-1-7281-6773-2

ISSN

2161-2536

e-ISSN

2161-2528

Počet stran výsledku

5

Strana od-do

—

Název nakladatele

IEEE Press

Místo vydání

New York

Místo konání akce

Demanovska Valley

Datum konání akce

14. 5. 2020

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

000610543500054