Influence of Intermetallic Compounds Growth on Properties of Lead-free Solder Joints
Identifikátory výsledku
Kód výsledku v IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F12%3A43925000" target="_blank" >RIV/49777513:23220/12:43925000 - isvavai.cz</a>
Výsledek na webu
<a href="http://dx.doi.org/10.1109/ISSE.2012.6273075" target="_blank" >http://dx.doi.org/10.1109/ISSE.2012.6273075</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE.2012.6273075" target="_blank" >10.1109/ISSE.2012.6273075</a>
Alternativní jazyky
Jazyk výsledku
angličtina
Název v původním jazyce
Influence of Intermetallic Compounds Growth on Properties of Lead-free Solder Joints
Popis výsledku v původním jazyce
This article deals with the growth of intermetallic compounds (IMCs) in solder joints and influence of these IMCs on properties of soldered joints. The test specimens of printed circuit boards (PCBs) with different surface finishes were made for this experiment. Tin_G (galvanic tin), Tin_C (immersion tin), Cu (pure copper), OSP (organic solderability preservative) and ENIG (electroless nickel immersion gold) surface finishes were chosen. The soldered joints were created on the test specimens by reflow soldering process. The surface mount solder joints of LCCC resistor of size 1206 were studied. Two lead-free solder paste and one tin-lead solder paste were chosen for research of IMCs and their influence on properties of soldered joints. The test specimens were exposed to elevated aging for research of IMCs growth in solder joint. The specimens were thermal stressed in hot air oven at the temperature of 150°C for a periods of 0, 1, 2, 4, 8, and 16 days. The shear test was used for resear
Název v anglickém jazyce
Influence of Intermetallic Compounds Growth on Properties of Lead-free Solder Joints
Popis výsledku anglicky
This article deals with the growth of intermetallic compounds (IMCs) in solder joints and influence of these IMCs on properties of soldered joints. The test specimens of printed circuit boards (PCBs) with different surface finishes were made for this experiment. Tin_G (galvanic tin), Tin_C (immersion tin), Cu (pure copper), OSP (organic solderability preservative) and ENIG (electroless nickel immersion gold) surface finishes were chosen. The soldered joints were created on the test specimens by reflow soldering process. The surface mount solder joints of LCCC resistor of size 1206 were studied. Two lead-free solder paste and one tin-lead solder paste were chosen for research of IMCs and their influence on properties of soldered joints. The test specimens were exposed to elevated aging for research of IMCs growth in solder joint. The specimens were thermal stressed in hot air oven at the temperature of 150°C for a periods of 0, 1, 2, 4, 8, and 16 days. The shear test was used for resear
Klasifikace
Druh
D - Stať ve sborníku
CEP obor
JA - Elektronika a optoelektronika, elektrotechnika
OECD FORD obor
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Návaznosti výsledku
Projekt
<a href="/cs/project/ED2.1.00%2F03.0094" target="_blank" >ED2.1.00/03.0094: Regionální inovační centrum elektrotechniky (RICE)</a><br>
Návaznosti
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)
Ostatní
Rok uplatnění
2012
Kód důvěrnosti údajů
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Údaje specifické pro druh výsledku
Název statě ve sborníku
35 th International Spring Seminar on Electronics Technology - Power Electronics
ISBN
978-1-4673-2240-9
ISSN
2161-2528
e-ISSN
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Počet stran výsledku
5
Strana od-do
213-217
Název nakladatele
Vienna University of Technology, Austria
Místo vydání
Vienna
Místo konání akce
Bad Aussee, Austria
Datum konání akce
9. 5. 2012
Typ akce podle státní příslušnosti
WRD - Celosvětová akce
Kód UT WoS článku
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