Long-term Behavior of IMCs in Lead-free Solder Joints

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F11%3A43898554" target="_blank" >RIV/49777513:23220/11:43898554 - isvavai.cz</a>

Výsledek na webu

<a href="http://dx.doi.org/10.1109/ISSE.2011.6053573" target="_blank" >http://dx.doi.org/10.1109/ISSE.2011.6053573</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/ISSE.2011.6053573" target="_blank" >10.1109/ISSE.2011.6053573</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Long-term Behavior of IMCs in Lead-free Solder Joints

Popis výsledku v původním jazyce

This article deals with the creation and growth of intermetallic compounds (IMCs) in solder joints. The test samples of copper substrate were made for experiment. The soldered joints were created on the test samples by hand soldering proces at the temperature of 250°C. Four lead-free solder alloys and one tin-lead solder alloy were chosen for research of IMCs. The test samples were divided into several groups. These groups differ in two parameters. The first parameter is soldering process. Half of the samples were soldered for a period of 10 s and the second half of samples were soldered for a period of 60 s. The second parameter is thermal stress. The test samples were exposed to elevated aging for research of long-term behavior of IMCs in solder joint. The samples were thermal stressed in hot air oven at the temperature of 150°C for a periods of 4, 8, 12, 16 and 20 weeks. The results of analysis of IMCs in solder joints using confocal and metallographic microscopes will be presented

Název v anglickém jazyce

Long-term Behavior of IMCs in Lead-free Solder Joints

Popis výsledku anglicky

This article deals with the creation and growth of intermetallic compounds (IMCs) in solder joints. The test samples of copper substrate were made for experiment. The soldered joints were created on the test samples by hand soldering proces at the temperature of 250°C. Four lead-free solder alloys and one tin-lead solder alloy were chosen for research of IMCs. The test samples were divided into several groups. These groups differ in two parameters. The first parameter is soldering process. Half of the samples were soldered for a period of 10 s and the second half of samples were soldered for a period of 60 s. The second parameter is thermal stress. The test samples were exposed to elevated aging for research of long-term behavior of IMCs in solder joint. The samples were thermal stressed in hot air oven at the temperature of 150°C for a periods of 4, 8, 12, 16 and 20 weeks. The results of analysis of IMCs in solder joints using confocal and metallographic microscopes will be presented

Druh

D - Stať ve sborníku

CEP obor

JA - Elektronika a optoelektronika, elektrotechnika

OECD FORD obor

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Projekt

—

Návaznosti

Z - Vyzkumny zamer (s odkazem do CEZ)<br>S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2011

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

ISSE 2011

ISBN

978-1-4577-2112-0

ISSN

2161-2528

e-ISSN

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Počet stran výsledku

6

Strana od-do

1-6

Název nakladatele

Technical Universita of Košice

Místo vydání

Košice

Místo konání akce

Tatranská Lomnice

Datum konání akce

11. 5. 2011

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

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