Effect of temperature cycling on IMC growth and solder joint strength of SAC305 solder alloy and REL61 low silver alloy

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F21%3APU141448" target="_blank" >RIV/00216305:26220/21:PU141448 - isvavai.cz</a>

Výsledek na webu

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DOI - Digital Object Identifier

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Jazyk výsledku

angličtina

Název v původním jazyce

Effect of temperature cycling on IMC growth and solder joint strength of SAC305 solder alloy and REL61 low silver alloy

Popis výsledku v původním jazyce

This work deals with the comparison of the standard SAC305 (Sn 96,5 %; Ag 3 %; Cu 0.5 %) solder alloy with melting temperature between 217 - 220 °C and an alternative alloy REL61 (SnBiAgCu) with lower silver content and melting temperature in the range of 208 - 215 °C in terms of IMC layer growth during temperature cycling and its effect on the shear strength of the solder joints. The test PCBs were soldered using two different temperature profiles and the temperature cycling was performed under two different conditions. Also, the mechanical strength of the solder joints in shear was measured. It can be concluded that the IMC growth on samples temperature cycled according the TC1 did not exceed the critical limit where the solder joint would be weakened for both alloys. For the samples temperature cycled according TC2 the IMC growth were lower in compare with samples cycled according TC1 but the impact on the shear strength is higher. It was also found that REL61 alloy achieved higher shear strength o

Název v anglickém jazyce

Effect of temperature cycling on IMC growth and solder joint strength of SAC305 solder alloy and REL61 low silver alloy

Popis výsledku anglicky

This work deals with the comparison of the standard SAC305 (Sn 96,5 %; Ag 3 %; Cu 0.5 %) solder alloy with melting temperature between 217 - 220 °C and an alternative alloy REL61 (SnBiAgCu) with lower silver content and melting temperature in the range of 208 - 215 °C in terms of IMC layer growth during temperature cycling and its effect on the shear strength of the solder joints. The test PCBs were soldered using two different temperature profiles and the temperature cycling was performed under two different conditions. Also, the mechanical strength of the solder joints in shear was measured. It can be concluded that the IMC growth on samples temperature cycled according the TC1 did not exceed the critical limit where the solder joint would be weakened for both alloys. For the samples temperature cycled according TC2 the IMC growth were lower in compare with samples cycled according TC1 but the impact on the shear strength is higher. It was also found that REL61 alloy achieved higher shear strength o

Druh

O - Ostatní výsledky

CEP obor

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OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

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Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2021

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů