Thermo-Mechanical Test of SnBi and SnCu Solder Joints on Different Surface Finishes

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F19%3A00338231" target="_blank" >RIV/68407700:21230/19:00338231 - isvavai.cz</a>

Výsledek na webu

<a href="https://doi.org/10.1109/ISSE.2019.8810299" target="_blank" >https://doi.org/10.1109/ISSE.2019.8810299</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/ISSE.2019.8810299" target="_blank" >10.1109/ISSE.2019.8810299</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Thermo-Mechanical Test of SnBi and SnCu Solder Joints on Different Surface Finishes

Popis výsledku v původním jazyce

The article deals with the heating factor influence on the solder joint reliability. A specific goal was to reveal the influence of the heating factor on the thickness of the Intermetallic Layer (IML) for Copper, Electroless Nickel Immersion Gold (ENIG) and Hot Air Solder Levelling (HASL) surface finishes and two lead free solders Sn42Bi58 and Sn99.3Cu0.7. Three different heating factors were used for hot air reflow of the Bismuth solder paste and another three for reflow of the SnCu solder paste. Micro-sections were prepared and the IMC (Inter-Metallic Compound) layer thickness was measured. The manufactured samples were subjected to destructive shear strength testing at laboratory temperature (20 degrees C) and at 65 degrees C. The results show an influence of intermetallic layer thickness on the shear strength and a minor decrease of the shear strength at elevated testing temperature for a low temperature Bismut based solder paste. When SnCu solder was used, the IMC layer was thicker and also the shear strength was lower, in an average (on all surface finishes) by 19%.

Název v anglickém jazyce

Thermo-Mechanical Test of SnBi and SnCu Solder Joints on Different Surface Finishes

Popis výsledku anglicky

The article deals with the heating factor influence on the solder joint reliability. A specific goal was to reveal the influence of the heating factor on the thickness of the Intermetallic Layer (IML) for Copper, Electroless Nickel Immersion Gold (ENIG) and Hot Air Solder Levelling (HASL) surface finishes and two lead free solders Sn42Bi58 and Sn99.3Cu0.7. Three different heating factors were used for hot air reflow of the Bismuth solder paste and another three for reflow of the SnCu solder paste. Micro-sections were prepared and the IMC (Inter-Metallic Compound) layer thickness was measured. The manufactured samples were subjected to destructive shear strength testing at laboratory temperature (20 degrees C) and at 65 degrees C. The results show an influence of intermetallic layer thickness on the shear strength and a minor decrease of the shear strength at elevated testing temperature for a low temperature Bismut based solder paste. When SnCu solder was used, the IMC layer was thicker and also the shear strength was lower, in an average (on all surface finishes) by 19%.

Druh

D - Stať ve sborníku

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

—

Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2019

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

2019 42nd International Spring Seminar on Electronics Technology (ISSE)

ISBN

978-1-7281-1874-1

ISSN

2161-2528

e-ISSN

2161-2536

Počet stran výsledku

4

Strana od-do

—

Název nakladatele

IEEE Press

Místo vydání

New York

Místo konání akce

Wroclaw

Datum konání akce

15. 5. 2019

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

000507501000071