INFLUENCE OF REFLOW TEMPERETURE PROFILE ON THE MECHANICAL PROPERTIES OF SOLDER JOINTS

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F16%3A00306400" target="_blank" >RIV/68407700:21230/16:00306400 - isvavai.cz</a>

Výsledek na webu

<a href="http://czech.imapseurope.org/index.php/imaps-flash-conference" target="_blank" >http://czech.imapseurope.org/index.php/imaps-flash-conference</a>

DOI - Digital Object Identifier

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Jazyk výsledku

angličtina

Název v původním jazyce

INFLUENCE OF REFLOW TEMPERETURE PROFILE ON THE MECHANICAL PROPERTIES OF SOLDER JOINTS

Popis výsledku v původním jazyce

A temperature profile has an impact on the final quality of the solder joints. It is important from the perspective of proper reflow of the solder alloy, the correct activation of the flux and not exceeding the maximum recommended temperature resistance of the components and PCB. Additionally the temperature profile has a significant influence on the formation of intermetallic compounds. The thickness of intermetalic layers depends on the heating factor – amount of heat after the moment when the solder alloy is already in the liquid state. This article compares mechanical properties of two solder pastes based on SnCu and SnBi regarding to the different temperature profiles. The passivated copper and ENIG were used as surface finishes of soldering pads. Comparison of mechanical properties was based on the shear test respectively on the pull-off force. The results shows that the shape of temperature profile, respectively the heating factor has the influence on the mechanical maximum pull-off force and thus on the mechanical properties of solder joints.

Název v anglickém jazyce

INFLUENCE OF REFLOW TEMPERETURE PROFILE ON THE MECHANICAL PROPERTIES OF SOLDER JOINTS

Popis výsledku anglicky

A temperature profile has an impact on the final quality of the solder joints. It is important from the perspective of proper reflow of the solder alloy, the correct activation of the flux and not exceeding the maximum recommended temperature resistance of the components and PCB. Additionally the temperature profile has a significant influence on the formation of intermetallic compounds. The thickness of intermetalic layers depends on the heating factor – amount of heat after the moment when the solder alloy is already in the liquid state. This article compares mechanical properties of two solder pastes based on SnCu and SnBi regarding to the different temperature profiles. The passivated copper and ENIG were used as surface finishes of soldering pads. Comparison of mechanical properties was based on the shear test respectively on the pull-off force. The results shows that the shape of temperature profile, respectively the heating factor has the influence on the mechanical maximum pull-off force and thus on the mechanical properties of solder joints.

Druh

D - Stať ve sborníku

CEP obor

JA - Elektronika a optoelektronika, elektrotechnika

OECD FORD obor

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Projekt

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Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2016

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

2nd Flash Conference 2016, Book of Abstracts

ISBN

978-80-214-5416-3

ISSN

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e-ISSN

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Počet stran výsledku

5

Strana od-do

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Název nakladatele

CEITEC - Central European Institute of Technology

Místo vydání

Brno

Místo konání akce

Brno University of Technology, FEEC

Datum konání akce

3. 11. 2016

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

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