Released of Latent Heat from Solder Joints to Surrounding during Solidification of Solder Alloy - Experimental Study
Identifikátory výsledku
Kód výsledku v IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F19%3A00338284" target="_blank" >RIV/68407700:21230/19:00338284 - isvavai.cz</a>
Výsledek na webu
<a href="https://doi.org/10.1109/ISSE.2019.8810199" target="_blank" >https://doi.org/10.1109/ISSE.2019.8810199</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE.2019.8810199" target="_blank" >10.1109/ISSE.2019.8810199</a>
Alternativní jazyky
Jazyk výsledku
angličtina
Název v původním jazyce
Released of Latent Heat from Solder Joints to Surrounding during Solidification of Solder Alloy - Experimental Study
Popis výsledku v původním jazyce
The thermal behavior of solder alloys during melting and solidification is important from point of many aspects. It has influence on formation of joint structure together with intermetallic compounds, reliability issues like tombstoning effect or warpage effect, dimensional changes of components and printed circuit board etc. This article deals with influence of released latent heat from solder joints on the surrounding temperature. Printed circuit boards with soldering pads designed side by side in the matrix and solder paste based on SAC387 solder alloy particles was used in experimental study. The influence of increased number of solder joints in a defined area was examined. The temperature profiles were measured below soldering pads during reflow soldering to find the thermal influences. The results show that released latent heat from solder joint has influence on surrounding temperature and it can delay the solidification of neighbor joint.
Název v anglickém jazyce
Released of Latent Heat from Solder Joints to Surrounding during Solidification of Solder Alloy - Experimental Study
Popis výsledku anglicky
The thermal behavior of solder alloys during melting and solidification is important from point of many aspects. It has influence on formation of joint structure together with intermetallic compounds, reliability issues like tombstoning effect or warpage effect, dimensional changes of components and printed circuit board etc. This article deals with influence of released latent heat from solder joints on the surrounding temperature. Printed circuit boards with soldering pads designed side by side in the matrix and solder paste based on SAC387 solder alloy particles was used in experimental study. The influence of increased number of solder joints in a defined area was examined. The temperature profiles were measured below soldering pads during reflow soldering to find the thermal influences. The results show that released latent heat from solder joint has influence on surrounding temperature and it can delay the solidification of neighbor joint.
Klasifikace
Druh
D - Stať ve sborníku
CEP obor
—
OECD FORD obor
20201 - Electrical and electronic engineering
Návaznosti výsledku
Projekt
—
Návaznosti
S - Specificky vyzkum na vysokych skolach
Ostatní
Rok uplatnění
2019
Kód důvěrnosti údajů
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Údaje specifické pro druh výsledku
Název statě ve sborníku
2019 42nd International Spring Seminar on Electronics Technology (ISSE)
ISBN
978-1-7281-1874-1
ISSN
2161-2528
e-ISSN
2161-2536
Počet stran výsledku
4
Strana od-do
—
Název nakladatele
IEEE Press
Místo vydání
New York
Místo konání akce
Wroclaw
Datum konání akce
15. 5. 2019
Typ akce podle státní příslušnosti
WRD - Celosvětová akce
Kód UT WoS článku
000507501000015