Latent heat induced deformation of PCB substrate: Measurement and simulation

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F22%3A00358666" target="_blank" >RIV/68407700:21230/22:00358666 - isvavai.cz</a>

Výsledek na webu

<a href="https://doi.org/10.1016/j.csite.2022.102173" target="_blank" >https://doi.org/10.1016/j.csite.2022.102173</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1016/j.csite.2022.102173" target="_blank" >10.1016/j.csite.2022.102173</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Latent heat induced deformation of PCB substrate: Measurement and simulation

Popis výsledku v původním jazyce

The work evaluates the impact of latent heat (LH) absorbed or released by a solder alloy during melting or solidification, respectively, on changes of dimensions of materials surrounding of the solder alloy. Our sample comprises a small printed circuit board (PCB) with a blind via filled with lead-free alloy SAC305. Differential scanning calorimetry (DSC) was employed to obtain the amount of LH per mass and a thermomechanical analyzer was used to measure the thermally induced deformation. A plateau during melting and a peak during solidification were detected during the course of dimension change. The peak height reached 1.6 mu m in the place of the heat source and 0.3 mu m in the distance of 3 mm from the source. The data measured during solidification was compared to a numerical model based on the finite element method. An excellent quantitative agreement was observed which confirms that the transient expansion of PCB during cooling can be explained by the release of LH from the solder alloy during solidification. Our results have important implications for the design of PCB assemblies where the contribution of recalescence to thermal stress can lead to solder joint failure.

Název v anglickém jazyce

Latent heat induced deformation of PCB substrate: Measurement and simulation

Popis výsledku anglicky

The work evaluates the impact of latent heat (LH) absorbed or released by a solder alloy during melting or solidification, respectively, on changes of dimensions of materials surrounding of the solder alloy. Our sample comprises a small printed circuit board (PCB) with a blind via filled with lead-free alloy SAC305. Differential scanning calorimetry (DSC) was employed to obtain the amount of LH per mass and a thermomechanical analyzer was used to measure the thermally induced deformation. A plateau during melting and a peak during solidification were detected during the course of dimension change. The peak height reached 1.6 mu m in the place of the heat source and 0.3 mu m in the distance of 3 mm from the source. The data measured during solidification was compared to a numerical model based on the finite element method. An excellent quantitative agreement was observed which confirms that the transient expansion of PCB during cooling can be explained by the release of LH from the solder alloy during solidification. Our results have important implications for the design of PCB assemblies where the contribution of recalescence to thermal stress can lead to solder joint failure.

Druh

J_imp - Článek v periodiku v databázi Web of Science

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

—

Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2022

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

Case Studies in Thermal Engineering

ISSN

2214-157X

e-ISSN

2214-157X

Svazek periodika

36

Číslo periodika v rámci svazku

102173

Stát vydavatele periodika

GB - Spojené království Velké Británie a Severního Irska

Počet stran výsledku

11

Strana od-do

—

Kód UT WoS článku

000813525000008

EID výsledku v databázi Scopus

2-s2.0-85132173790