Influence of latent heat released from solder joints on the reflow temperature profile

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216208%3A11320%2F16%3A10321715" target="_blank" >RIV/00216208:11320/16:10321715 - isvavai.cz</a>

Nalezeny alternativní kódy

RIV/68407700:21230/16:00233829

Výsledek na webu

<a href="http://dx.doi.org/10.1007/s10854-015-3787-4" target="_blank" >http://dx.doi.org/10.1007/s10854-015-3787-4</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1007/s10854-015-3787-4" target="_blank" >10.1007/s10854-015-3787-4</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Influence of latent heat released from solder joints on the reflow temperature profile

Popis výsledku v původním jazyce

The reflow process of SAC305 solder paste was investigated by differential scanning calorimetry (DSC) and measurement of the temperature profiles in a real continual convection reflow furnace. Melting and solidification processes of two solder joints were investigated by both methods to determine the influence of latent heat on the surrounding temperature. While one peak was present during melting in DSC, two peaks were present during solidification of two joints connected by a resistor. The released latent heat from one joint increased the temperature of the surroundings and delayed the solidification process of the second joint. Analysis of the temperature profiles obtained during the reflow processes in a real furnace shows that latent heat influences the surrounding temperature not only during the phase transformation, but also during the whole following passage of the sample in the furnace. The maximum temperature increase of the joint is substantial: 25 mg of the solder paste increases the joint temperature by about 15 degrees C. When two joints are placed on the sample the temperature increase is close to 20 degrees C.

Název v anglickém jazyce

Influence of latent heat released from solder joints on the reflow temperature profile

Popis výsledku anglicky

The reflow process of SAC305 solder paste was investigated by differential scanning calorimetry (DSC) and measurement of the temperature profiles in a real continual convection reflow furnace. Melting and solidification processes of two solder joints were investigated by both methods to determine the influence of latent heat on the surrounding temperature. While one peak was present during melting in DSC, two peaks were present during solidification of two joints connected by a resistor. The released latent heat from one joint increased the temperature of the surroundings and delayed the solidification process of the second joint. Analysis of the temperature profiles obtained during the reflow processes in a real furnace shows that latent heat influences the surrounding temperature not only during the phase transformation, but also during the whole following passage of the sample in the furnace. The maximum temperature increase of the joint is substantial: 25 mg of the solder paste increases the joint temperature by about 15 degrees C. When two joints are placed on the sample the temperature increase is close to 20 degrees C.

Druh

J_x - Nezařazeno - Článek v odborném periodiku (Jimp, Jsc a Jost)

CEP obor

JA - Elektronika a optoelektronika, elektrotechnika

OECD FORD obor

—

Projekt

<a href="/cs/project/LM2011025" target="_blank" >LM2011025: LMNT - Laboratoře magnetizmu a nízkých teplot - provoz a rozvoj národní výzkumné infrastruktury</a><br>

Návaznosti

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Rok uplatnění

2016

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

Journal of Materials Science: Materials in Electronics

ISSN

0957-4522

e-ISSN

—

Svazek periodika

27

Číslo periodika v rámci svazku

1

Stát vydavatele periodika

NL - Nizozemsko

Počet stran výsledku

7

Strana od-do

543-549

Kód UT WoS článku

000368054600073

EID výsledku v databázi Scopus

2-s2.0-84954386669