Experimental and Numerical Analysis of Melting and Solidification of SnAgCu Joints

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F16%3A00301669" target="_blank" >RIV/68407700:21230/16:00301669 - isvavai.cz</a>

Výsledek na webu

<a href="http://dx.doi.org/10.1109/TCPMT.2016.2593709" target="_blank" >http://dx.doi.org/10.1109/TCPMT.2016.2593709</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/TCPMT.2016.2593709" target="_blank" >10.1109/TCPMT.2016.2593709</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Experimental and Numerical Analysis of Melting and Solidification of SnAgCu Joints

Popis výsledku v původním jazyce

One of the most vulnerable components of electronic circuits is the solder joints. The most common technique of soldering used in electronics is the reflow soldering. During the soldering process, different issues may occur leading to the inception of some defects (tombstone effect, flux spattering, etc.). To avoid these defects, it is mandatory to follow the parameter values of the reflow process, especially temperature values. In this paper, the temperature distribution for three types of samples (two interconnected soldering pads–without solder, with solder on one pad, and with solder on both pads) during the reflow soldering process, calculated with Comsol Multiphysics software (heat transfer 3-D module) is presented. The calculated values are then compared to the ones obtained by experiments in order to verify the accuracy of the numerical model. To carry out the computations, the latent heat of melting/solidification and the variation with the temperature of the solder parameters were considered. The results show that there is a good correlation between the measured and calculated values, the differences (for all types of samples) being lower than ±3 °C.

Název v anglickém jazyce

Experimental and Numerical Analysis of Melting and Solidification of SnAgCu Joints

Popis výsledku anglicky

One of the most vulnerable components of electronic circuits is the solder joints. The most common technique of soldering used in electronics is the reflow soldering. During the soldering process, different issues may occur leading to the inception of some defects (tombstone effect, flux spattering, etc.). To avoid these defects, it is mandatory to follow the parameter values of the reflow process, especially temperature values. In this paper, the temperature distribution for three types of samples (two interconnected soldering pads–without solder, with solder on one pad, and with solder on both pads) during the reflow soldering process, calculated with Comsol Multiphysics software (heat transfer 3-D module) is presented. The calculated values are then compared to the ones obtained by experiments in order to verify the accuracy of the numerical model. To carry out the computations, the latent heat of melting/solidification and the variation with the temperature of the solder parameters were considered. The results show that there is a good correlation between the measured and calculated values, the differences (for all types of samples) being lower than ±3 °C.

Druh

J_x - Nezařazeno - Článek v odborném periodiku (Jimp, Jsc a Jost)

CEP obor

JA - Elektronika a optoelektronika, elektrotechnika

OECD FORD obor

—

Projekt

—

Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2016

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

IEEE Transactions on Components, Packaging and Manufacturing Technology

ISSN

2156-3950

e-ISSN

—

Svazek periodika

6

Číslo periodika v rámci svazku

9

Stát vydavatele periodika

US - Spojené státy americké

Počet stran výsledku

11

Strana od-do

—

Kód UT WoS článku

000384647200016

EID výsledku v databázi Scopus

2-s2.0-84983048364