Surface finish influence on PCB contamination by flux spattering effect

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216208%3A11320%2F15%3A10314669" target="_blank" >RIV/00216208:11320/15:10314669 - isvavai.cz</a>

Nalezeny alternativní kódy

RIV/68407700:21230/15:00233972

Výsledek na webu

<a href="http://dx.doi.org/10.1109/ISSE.2015.7247998" target="_blank" >http://dx.doi.org/10.1109/ISSE.2015.7247998</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/ISSE.2015.7247998" target="_blank" >10.1109/ISSE.2015.7247998</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Surface finish influence on PCB contamination by flux spattering effect

Popis výsledku v původním jazyce

Mechanical stability of solder joints has influence on total reliability of electronic products. Mechanical stress affect on properties of solder joints during function, transport and storage of the electronic products. A method which is commonly used inelectronic industry to classify Flux spattering effect can appear during the manufacturing assembly process, especially during reflow process, when the solder paste, which contains flux, is heated and the flux is spattered and contaminate surroundings.This effect mostly happened due to moisture absorption by the solder paste or due to improperly temperature profile settings during the reflow process. Spattered residues of flux have a non-conductive character and therefore it caused a problem in quality testing of the product, especially when a spot of flux reside appear on the PCB testing pad than the in-circuit test marked tested product as the bad one even though that it is a good one. This article deals with influence of surface fi

Název v anglickém jazyce

Surface finish influence on PCB contamination by flux spattering effect

Popis výsledku anglicky

Mechanical stability of solder joints has influence on total reliability of electronic products. Mechanical stress affect on properties of solder joints during function, transport and storage of the electronic products. A method which is commonly used inelectronic industry to classify Flux spattering effect can appear during the manufacturing assembly process, especially during reflow process, when the solder paste, which contains flux, is heated and the flux is spattered and contaminate surroundings.This effect mostly happened due to moisture absorption by the solder paste or due to improperly temperature profile settings during the reflow process. Spattered residues of flux have a non-conductive character and therefore it caused a problem in quality testing of the product, especially when a spot of flux reside appear on the PCB testing pad than the in-circuit test marked tested product as the bad one even though that it is a good one. This article deals with influence of surface fi

Druh

D - Stať ve sborníku

CEP obor

JA - Elektronika a optoelektronika, elektrotechnika

OECD FORD obor

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Projekt

<a href="/cs/project/LM2011025" target="_blank" >LM2011025: LMNT - Laboratoře magnetizmu a nízkých teplot - provoz a rozvoj národní výzkumné infrastruktury</a><br>

Návaznosti

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Rok uplatnění

2015

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

Proceedings of the International Spring Seminar on Electronics Technology

ISBN

978-1-4799-8860-0

ISSN

2161-2528

e-ISSN

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Počet stran výsledku

4

Strana od-do

241-244

Název nakladatele

IEEE

Místo vydání

New York, USA

Místo konání akce

Eger, Hungary

Datum konání akce

6. 5. 2015

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

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