Toward reducing no-clean flux spatter during reflow soldering: Investigating the effect of flux type, solder mask, and solder pad design

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F22%3A00358881" target="_blank" >RIV/68407700:21230/22:00358881 - isvavai.cz</a>

Výsledek na webu

<a href="https://doi.org/10.1016/j.jmapro.2022.07.027" target="_blank" >https://doi.org/10.1016/j.jmapro.2022.07.027</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1016/j.jmapro.2022.07.027" target="_blank" >10.1016/j.jmapro.2022.07.027</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Toward reducing no-clean flux spatter during reflow soldering: Investigating the effect of flux type, solder mask, and solder pad design

Popis výsledku v původním jazyce

This comprehensive study dealt with the reliability issue of no-clean flux spattering from the solder paste during the reflow soldering process. Several factors entering the process were investigated: the type of flux in the solder paste (ROL0/ROL1 according to the IPC J-STD-004B standard), the type of solder mask (liquid photo imageable/directly printed), and the type of solder pad design (copper-defined/solder mask-defined). A unique design of the test board was developed for a proper evaluation of flux spatter spots spattered from the solder paste. The testing board included real-sized soldering pads and a boron-silicate glass slide as a target area, ensuring the same evaluation process for all samples. The results showed a strong influence of flux chemistry on spattering. Changing the flux from ROL1 to ROL0 reduced the flux spot occurrence by 62 % on average. The type of solder pad design also slightly affected the flux spattering. No significant difference was found between the used solder masks; therefore, it is possible to use the novel, directly printed one without increasing the risk of flux spattering.

Název v anglickém jazyce

Toward reducing no-clean flux spatter during reflow soldering: Investigating the effect of flux type, solder mask, and solder pad design

Popis výsledku anglicky

This comprehensive study dealt with the reliability issue of no-clean flux spattering from the solder paste during the reflow soldering process. Several factors entering the process were investigated: the type of flux in the solder paste (ROL0/ROL1 according to the IPC J-STD-004B standard), the type of solder mask (liquid photo imageable/directly printed), and the type of solder pad design (copper-defined/solder mask-defined). A unique design of the test board was developed for a proper evaluation of flux spatter spots spattered from the solder paste. The testing board included real-sized soldering pads and a boron-silicate glass slide as a target area, ensuring the same evaluation process for all samples. The results showed a strong influence of flux chemistry on spattering. Changing the flux from ROL1 to ROL0 reduced the flux spot occurrence by 62 % on average. The type of solder pad design also slightly affected the flux spattering. No significant difference was found between the used solder masks; therefore, it is possible to use the novel, directly printed one without increasing the risk of flux spattering.

Druh

J_imp - Článek v periodiku v databázi Web of Science

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

—

Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2022

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

Journal of Manufacturing Processes

ISSN

1526-6125

e-ISSN

2212-4616

Svazek periodika

81

Číslo periodika v rámci svazku

9

Stát vydavatele periodika

DE - Spolková republika Německo

Počet stran výsledku

11

Strana od-do

696-706

Kód UT WoS článku

000890918700001

EID výsledku v databázi Scopus

2-s2.0-85134841276