Influence of Flux and Related Factors on Intermetallic Layer Growth within SAC305 Solder Joints

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F21%3A00353696" target="_blank" >RIV/68407700:21230/21:00353696 - isvavai.cz</a>

Výsledek na webu

<a href="https://doi.org/10.3390/ma14247909" target="_blank" >https://doi.org/10.3390/ma14247909</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.3390/ma14247909" target="_blank" >10.3390/ma14247909</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Influence of Flux and Related Factors on Intermetallic Layer Growth within SAC305 Solder Joints

Popis výsledku v původním jazyce

Flux contained in solder paste significantly affects the process of solder joint creation during reflow soldering, including the creation of an intermetallic layer (IML). This work investigates the dependence of intermetallic layer thickness on ROL0/ROL1 flux classification, glossy or matt solder mask, and OSP/HASL/ENIG soldering pad surface finish. Two original SAC305 solder pastes differing only in the used flux were chosen for the experiment. The influence of multiple reflows was also observed. The intermetallic layer thicknesses were obtained by the image analysis of micro-section images. The flux type proved to have a significant impact on the intermetallic layer thickness. The solder paste with ROL1 caused an increase in IML thickness by up to 40% in comparison to an identical paste with ROL0 flux. Furthermore, doubling the roughness of the solder mask has increased the resulting IML thickness by 37% at HASL surface finish and by an average of 22%.

Název v anglickém jazyce

Influence of Flux and Related Factors on Intermetallic Layer Growth within SAC305 Solder Joints

Popis výsledku anglicky

Flux contained in solder paste significantly affects the process of solder joint creation during reflow soldering, including the creation of an intermetallic layer (IML). This work investigates the dependence of intermetallic layer thickness on ROL0/ROL1 flux classification, glossy or matt solder mask, and OSP/HASL/ENIG soldering pad surface finish. Two original SAC305 solder pastes differing only in the used flux were chosen for the experiment. The influence of multiple reflows was also observed. The intermetallic layer thicknesses were obtained by the image analysis of micro-section images. The flux type proved to have a significant impact on the intermetallic layer thickness. The solder paste with ROL1 caused an increase in IML thickness by up to 40% in comparison to an identical paste with ROL0 flux. Furthermore, doubling the roughness of the solder mask has increased the resulting IML thickness by 37% at HASL surface finish and by an average of 22%.

Druh

J_imp - Článek v periodiku v databázi Web of Science

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

—

Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2021

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

Materials

ISSN

1996-1944

e-ISSN

1996-1944

Svazek periodika

14

Číslo periodika v rámci svazku

24

Stát vydavatele periodika

CH - Švýcarská konfederace

Počet stran výsledku

13

Strana od-do

—

Kód UT WoS článku

000738344300001

EID výsledku v databázi Scopus

2-s2.0-85121569995